Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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ABA-SAT-022-K04 | LOTES |
на замовлення 2694 шт: термін постачання 14-28 дні (днів) |
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ACA-SPI-001-T03 | LOTES |
на замовлення 2400 шт: термін постачання 14-28 дні (днів) |
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ACA-SPI-004-K01 | LOTES |
Description: SPI 8 PIN_IC 208mil Packaging: Tape & Reel (TR) Features: Board Guide, Closed Frame Mounting Type: Surface Mount Type: SOIC Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Liquid Crystal Polymer (LCP) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 1.00µin (0.025µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 1.00µin (0.025µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 2090 шт: термін постачання 21-31 дні (днів) |
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ACA-SPI-006-K01 | LOTES |
Description: SPI 16 PIN_IC 300mil Packaging: Tape & Reel (TR) Features: Board Guide, Closed Frame Mounting Type: Surface Mount Type: SOIC Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Liquid Crystal Polymer (LCP) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 1.00µin (0.025µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 1.00µin (0.025µm) Contact Material - Post: Phosphor Bronze |
на замовлення 800 шт: термін постачання 21-31 дні (днів) |
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ACA-Z1F-046-K01-A | LOTES |
на замовлення 15 шт: термін постачання 14-28 дні (днів) |
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ACA-ZIF-068-P02 | LOTES |
на замовлення 958 шт: термін постачання 14-28 дні (днів) |
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AEA-BTB-023-T80 BTB HD | LOTES | 08+ SMD |
на замовлення 8746 шт: термін постачання 14-28 дні (днів) |
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ASPI0001-P001A | LOTES |
Description: SPI 8 PIN_IC 150mil Packaging: Tape & Reel (TR) Features: Board Guide, Closed Frame Mounting Type: Surface Mount Type: SOIC Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Liquid Crystal Polymer (LCP) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 1.00µin (0.025µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 1.00µin (0.025µm) Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 2100 шт: термін постачання 21-31 дні (днів) |
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ASPI0002-P001A | LOTES |
Description: SPI 8Pin WSON 8X6 Features: Board Guide, Closed Frame Packaging: Tape & Reel (TR) Mounting Type: Surface Mount Type: SOIC Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Liquid Crystal Polymer (LCP) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: FLASH Contact Material - Post: Phosphor Bronze Part Status: Active |
на замовлення 3880 шт: термін постачання 21-31 дні (днів) |
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ACA-SPI-004-K01 |
Виробник: LOTES
Description: SPI 8 PIN_IC 208mil
Packaging: Tape & Reel (TR)
Features: Board Guide, Closed Frame
Mounting Type: Surface Mount
Type: SOIC
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 1.00µin (0.025µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 1.00µin (0.025µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: SPI 8 PIN_IC 208mil
Packaging: Tape & Reel (TR)
Features: Board Guide, Closed Frame
Mounting Type: Surface Mount
Type: SOIC
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 1.00µin (0.025µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 1.00µin (0.025µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 2090 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
10+ | 1363.09 грн |
50+ | 656.3 грн |
100+ | 393.78 грн |
200+ | 246.37 грн |
700+ | 123.18 грн |
ACA-SPI-006-K01 |
Виробник: LOTES
Description: SPI 16 PIN_IC 300mil
Packaging: Tape & Reel (TR)
Features: Board Guide, Closed Frame
Mounting Type: Surface Mount
Type: SOIC
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 1.00µin (0.025µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 1.00µin (0.025µm)
Contact Material - Post: Phosphor Bronze
Description: SPI 16 PIN_IC 300mil
Packaging: Tape & Reel (TR)
Features: Board Guide, Closed Frame
Mounting Type: Surface Mount
Type: SOIC
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 1.00µin (0.025µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 1.00µin (0.025µm)
Contact Material - Post: Phosphor Bronze
на замовлення 800 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
10+ | 1310.2 грн |
50+ | 630.84 грн |
100+ | 378.5 грн |
200+ | 236.81 грн |
550+ | 118.4 грн |
AEA-BTB-023-T80 BTB HD |
Виробник: LOTES
08+ SMD
08+ SMD
на замовлення 8746 шт:
термін постачання 14-28 дні (днів)ASPI0001-P001A |
Виробник: LOTES
Description: SPI 8 PIN_IC 150mil
Packaging: Tape & Reel (TR)
Features: Board Guide, Closed Frame
Mounting Type: Surface Mount
Type: SOIC
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 1.00µin (0.025µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 1.00µin (0.025µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: SPI 8 PIN_IC 150mil
Packaging: Tape & Reel (TR)
Features: Board Guide, Closed Frame
Mounting Type: Surface Mount
Type: SOIC
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 1.00µin (0.025µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 1.00µin (0.025µm)
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 2100 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
50+ | 122.15 грн |
100+ | 114.17 грн |
300+ | 107.25 грн |
700+ | 81.17 грн |
2100+ | 61.69 грн |
ASPI0002-P001A |
Виробник: LOTES
Description: SPI 8Pin WSON 8X6
Features: Board Guide, Closed Frame
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Type: SOIC
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Phosphor Bronze
Part Status: Active
Description: SPI 8Pin WSON 8X6
Features: Board Guide, Closed Frame
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Type: SOIC
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Phosphor Bronze
Part Status: Active
на замовлення 3880 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
10+ | 1360.21 грн |
50+ | 654.92 грн |
100+ | 392.95 грн |
200+ | 245.85 грн |
700+ | 122.92 грн |