Результат пошуку "27-4165" : 20
Вид перегляду :
Мінімальне замовлення: 2
Мінімальне замовлення: 3000
Мінімальне замовлення: 9
Мінімальне замовлення: 3000
Мінімальне замовлення: 11
Мінімальне замовлення: 4
Мінімальне замовлення: 1500
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
2741650000 | WEIDMULLER |
Description: WEIDMULLER - 2741650000 - Steckbare Reihenklemme, 5 mm, 11 -polig, 20AWG bis 14AWG, 2.5 mm², Einrastmontage, 26.8 A tariffCode: 85366990 rohsCompliant: YES Nennspannung: 400V hazardous: false rohsPhthalatesCompliant: YES Nennstrom: 26.8A usEccn: EAR99 Drahtanschlussverfahren: Einrastmontage Anzahl der Positionen: 11Ways Leiterquerschnitt CSA: 2.5mm² euEccn: NLR Leiterstärke (AWG): 20AWG bis 14AWG Produktpalette: Omnimate 4.0 MPS productTraceability: No Rastermaß: 5mm SVHC: No SVHC (17-Jan-2023) |
на замовлення 118 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||
2741650000 | Weidmuller | Pluggable Terminal Blocks MPS 5/11 S TN B B |
на замовлення 30 шт: термін постачання 21-30 дні (днів) |
|
|||||||||||||||
2741650000 | Weidmüller |
Description: PCB CONNECTOR, PLUG, 5.00MM PITC Packaging: Box Color: Black Mounting Type: Free Hanging (In-Line) Number of Positions: 11 Pitch: 0.197" (5.00mm) Type: Plug, Female Sockets Operating Temperature: -50°C ~ 100°C Termination Style: Screwless - Snap In Number of Levels: 1 Wire Gauge or Range - AWG: 14-18 AWG Wire Gauge or Range - mm²: 0.5-2.5mm² Positions Per Level: 11 Plug Wire Entry: 180° Contact Mating Finish: Tin Part Status: Active Current - UL: 18.5 A Voltage - IEC: 400 V Voltage - UL: 300 V |
на замовлення 59 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||
2741650000 | Weidmuller | 2741650000 |
на замовлення 30 шт: термін постачання 21-31 дні (днів) |
||||||||||||||||
74LVC2G07GW,125 | Nexperia USA Inc. |
Description: IC BUF NON-INVERT 5.5V 6TSSOP Packaging: Tape & Reel (TR) Package / Case: 6-TSSOP, SC-88, SOT-363 Output Type: Open Drain Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.65V ~ 5.5V Number of Bits per Element: 1 Current - Output High, Low: -, 32mA Supplier Device Package: 6-TSSOP Part Status: Active |
на замовлення 87000 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||
74LVC2G07GW,125 | Nexperia USA Inc. |
Description: IC BUF NON-INVERT 5.5V 6TSSOP Packaging: Cut Tape (CT) Package / Case: 6-TSSOP, SC-88, SOT-363 Output Type: Open Drain Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.65V ~ 5.5V Number of Bits per Element: 1 Current - Output High, Low: -, 32mA Supplier Device Package: 6-TSSOP Part Status: Active |
на замовлення 88759 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||
74LVC2G07GW,125 | NEXPERIA | Buffer/Driver 2-CH Non-Inverting Open Drain CMOS 6-Pin TSSOP T/R |
на замовлення 3000 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||
74LVC2G07GW,125 | Nexperia | Buffers & Line Drivers 74LVC2G07GW/SOT363/SC-88 |
на замовлення 164295 шт: термін постачання 21-30 дні (днів) |
|
|||||||||||||||
ADS1147IPW | Texas Instruments |
Description: IC ADC 16BIT SIGMA-DELTA 20TSSOP Packaging: Tube Features: PGA Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Number of Bits: 16 Configuration: MUX-PGA-ADC Data Interface: SPI Reference Type: External, Internal Operating Temperature: -40°C ~ 105°C Voltage - Supply, Analog: 2.7V ~ 5.25V Voltage - Supply, Digital: 2.7V ~ 5.25V Sampling Rate (Per Second): 2k Input Type: Differential, Single Ended Number of Inputs: 2, 3 Supplier Device Package: 20-TSSOP Architecture: Sigma-Delta Number of A/D Converters: 1 |
на замовлення 1830 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||
PSMN3R0-30YL,115 | Nexperia USA Inc. |
Description: MOSFET N-CH 30V 100A LFPAK56 Packaging: Cut Tape (CT) Package / Case: SC-100, SOT-669 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 100A (Tc) Rds On (Max) @ Id, Vgs: 3mOhm @ 15A, 10V Power Dissipation (Max): 81W (Tc) Vgs(th) (Max) @ Id: 2.15V @ 1mA Supplier Device Package: LFPAK56, Power-SO8 Part Status: Not For New Designs Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 30 V Gate Charge (Qg) (Max) @ Vgs: 45.8 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 2822 pF @ 12 V |
на замовлення 41952 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||
PSMN3R0-30YL,115 | Nexperia USA Inc. |
Description: MOSFET N-CH 30V 100A LFPAK56 Packaging: Tape & Reel (TR) Package / Case: SC-100, SOT-669 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 100A (Tc) Rds On (Max) @ Id, Vgs: 3mOhm @ 15A, 10V Power Dissipation (Max): 81W (Tc) Vgs(th) (Max) @ Id: 2.15V @ 1mA Supplier Device Package: LFPAK56, Power-SO8 Part Status: Not For New Designs Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 30 V Gate Charge (Qg) (Max) @ Vgs: 45.8 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 2822 pF @ 12 V |
на замовлення 40500 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||
127-41-652-41-002000 | Mill-Max | IC & Component Sockets DIP Dual In Line Socket |
товар відсутній |
||||||||||||||||
127-41-652-41-002000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 52 (2 x 26) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товар відсутній |
||||||||||||||||
127-41-652-41-003000 | Mill-Max | IC & Component Sockets DIP Dual In Line Socket |
товар відсутній |
||||||||||||||||
127-41-652-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 52 (2 x 26) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товар відсутній |
||||||||||||||||
127-41-656-41-002000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 56 (2 x 28) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товар відсутній |
||||||||||||||||
127-41-656-41-002000 | Mill-Max | IC & Component Sockets DIP Dual In Line Socket |
товар відсутній |
||||||||||||||||
127-41-656-41-003000 | Mill-Max | IC & Component Sockets DIP Dual In Line Socket |
товар відсутній |
||||||||||||||||
127-41-656-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 56 (2 x 28) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товар відсутній |
||||||||||||||||
CA3106E24-5S-F80 | ITT Cannon | Circular MIL Spec Connector |
товар відсутній |
2741650000 |
Виробник: WEIDMULLER
Description: WEIDMULLER - 2741650000 - Steckbare Reihenklemme, 5 mm, 11 -polig, 20AWG bis 14AWG, 2.5 mm², Einrastmontage, 26.8 A
tariffCode: 85366990
rohsCompliant: YES
Nennspannung: 400V
hazardous: false
rohsPhthalatesCompliant: YES
Nennstrom: 26.8A
usEccn: EAR99
Drahtanschlussverfahren: Einrastmontage
Anzahl der Positionen: 11Ways
Leiterquerschnitt CSA: 2.5mm²
euEccn: NLR
Leiterstärke (AWG): 20AWG bis 14AWG
Produktpalette: Omnimate 4.0 MPS
productTraceability: No
Rastermaß: 5mm
SVHC: No SVHC (17-Jan-2023)
Description: WEIDMULLER - 2741650000 - Steckbare Reihenklemme, 5 mm, 11 -polig, 20AWG bis 14AWG, 2.5 mm², Einrastmontage, 26.8 A
tariffCode: 85366990
rohsCompliant: YES
Nennspannung: 400V
hazardous: false
rohsPhthalatesCompliant: YES
Nennstrom: 26.8A
usEccn: EAR99
Drahtanschlussverfahren: Einrastmontage
Anzahl der Positionen: 11Ways
Leiterquerschnitt CSA: 2.5mm²
euEccn: NLR
Leiterstärke (AWG): 20AWG bis 14AWG
Produktpalette: Omnimate 4.0 MPS
productTraceability: No
Rastermaß: 5mm
SVHC: No SVHC (17-Jan-2023)
на замовлення 118 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 533.98 грн |
10+ | 467.33 грн |
100+ | 458.34 грн |
2741650000 |
Виробник: Weidmuller
Pluggable Terminal Blocks MPS 5/11 S TN B B
Pluggable Terminal Blocks MPS 5/11 S TN B B
на замовлення 30 шт:
термін постачання 21-30 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 753.96 грн |
10+ | 654.89 грн |
30+ | 536.76 грн |
60+ | 510.72 грн |
120+ | 501.38 грн |
270+ | 436.62 грн |
510+ | 420.6 грн |
2741650000 |
Виробник: Weidmüller
Description: PCB CONNECTOR, PLUG, 5.00MM PITC
Packaging: Box
Color: Black
Mounting Type: Free Hanging (In-Line)
Number of Positions: 11
Pitch: 0.197" (5.00mm)
Type: Plug, Female Sockets
Operating Temperature: -50°C ~ 100°C
Termination Style: Screwless - Snap In
Number of Levels: 1
Wire Gauge or Range - AWG: 14-18 AWG
Wire Gauge or Range - mm²: 0.5-2.5mm²
Positions Per Level: 11
Plug Wire Entry: 180°
Contact Mating Finish: Tin
Part Status: Active
Current - UL: 18.5 A
Voltage - IEC: 400 V
Voltage - UL: 300 V
Description: PCB CONNECTOR, PLUG, 5.00MM PITC
Packaging: Box
Color: Black
Mounting Type: Free Hanging (In-Line)
Number of Positions: 11
Pitch: 0.197" (5.00mm)
Type: Plug, Female Sockets
Operating Temperature: -50°C ~ 100°C
Termination Style: Screwless - Snap In
Number of Levels: 1
Wire Gauge or Range - AWG: 14-18 AWG
Wire Gauge or Range - mm²: 0.5-2.5mm²
Positions Per Level: 11
Plug Wire Entry: 180°
Contact Mating Finish: Tin
Part Status: Active
Current - UL: 18.5 A
Voltage - IEC: 400 V
Voltage - UL: 300 V
на замовлення 59 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 722.9 грн |
10+ | 612.4 грн |
30+ | 577.62 грн |
74LVC2G07GW,125 |
Виробник: Nexperia USA Inc.
Description: IC BUF NON-INVERT 5.5V 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-TSSOP
Part Status: Active
Description: IC BUF NON-INVERT 5.5V 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-TSSOP
Part Status: Active
на замовлення 87000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3000+ | 6.07 грн |
6000+ | 5.26 грн |
15000+ | 4.68 грн |
30000+ | 4.12 грн |
75000+ | 3.65 грн |
74LVC2G07GW,125 |
Виробник: Nexperia USA Inc.
Description: IC BUF NON-INVERT 5.5V 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-TSSOP
Part Status: Active
Description: IC BUF NON-INVERT 5.5V 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-TSSOP
Part Status: Active
на замовлення 88759 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
9+ | 32.5 грн |
12+ | 23.37 грн |
25+ | 20.47 грн |
100+ | 12.43 грн |
250+ | 10.29 грн |
500+ | 8.23 грн |
1000+ | 6.21 грн |
74LVC2G07GW,125 |
Виробник: NEXPERIA
Buffer/Driver 2-CH Non-Inverting Open Drain CMOS 6-Pin TSSOP T/R
Buffer/Driver 2-CH Non-Inverting Open Drain CMOS 6-Pin TSSOP T/R
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3000+ | 3.18 грн |
74LVC2G07GW,125 |
Виробник: Nexperia
Buffers & Line Drivers 74LVC2G07GW/SOT363/SC-88
Buffers & Line Drivers 74LVC2G07GW/SOT363/SC-88
на замовлення 164295 шт:
термін постачання 21-30 дні (днів)Кількість | Ціна без ПДВ |
---|---|
11+ | 28.97 грн |
19+ | 16.81 грн |
100+ | 8.41 грн |
1000+ | 6.01 грн |
3000+ | 4.41 грн |
9000+ | 3.94 грн |
24000+ | 3.74 грн |
ADS1147IPW |
Виробник: Texas Instruments
Description: IC ADC 16BIT SIGMA-DELTA 20TSSOP
Packaging: Tube
Features: PGA
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Bits: 16
Configuration: MUX-PGA-ADC
Data Interface: SPI
Reference Type: External, Internal
Operating Temperature: -40°C ~ 105°C
Voltage - Supply, Analog: 2.7V ~ 5.25V
Voltage - Supply, Digital: 2.7V ~ 5.25V
Sampling Rate (Per Second): 2k
Input Type: Differential, Single Ended
Number of Inputs: 2, 3
Supplier Device Package: 20-TSSOP
Architecture: Sigma-Delta
Number of A/D Converters: 1
Description: IC ADC 16BIT SIGMA-DELTA 20TSSOP
Packaging: Tube
Features: PGA
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Bits: 16
Configuration: MUX-PGA-ADC
Data Interface: SPI
Reference Type: External, Internal
Operating Temperature: -40°C ~ 105°C
Voltage - Supply, Analog: 2.7V ~ 5.25V
Voltage - Supply, Digital: 2.7V ~ 5.25V
Sampling Rate (Per Second): 2k
Input Type: Differential, Single Ended
Number of Inputs: 2, 3
Supplier Device Package: 20-TSSOP
Architecture: Sigma-Delta
Number of A/D Converters: 1
на замовлення 1830 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 717.12 грн |
10+ | 624.08 грн |
70+ | 595.08 грн |
140+ | 484.91 грн |
280+ | 463.11 грн |
560+ | 422.25 грн |
1050+ | 361.74 грн |
PSMN3R0-30YL,115 |
Виробник: Nexperia USA Inc.
Description: MOSFET N-CH 30V 100A LFPAK56
Packaging: Cut Tape (CT)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 3mOhm @ 15A, 10V
Power Dissipation (Max): 81W (Tc)
Vgs(th) (Max) @ Id: 2.15V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Part Status: Not For New Designs
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 45.8 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2822 pF @ 12 V
Description: MOSFET N-CH 30V 100A LFPAK56
Packaging: Cut Tape (CT)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 3mOhm @ 15A, 10V
Power Dissipation (Max): 81W (Tc)
Vgs(th) (Max) @ Id: 2.15V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Part Status: Not For New Designs
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 45.8 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2822 pF @ 12 V
на замовлення 41952 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
4+ | 82.33 грн |
10+ | 64.74 грн |
100+ | 50.35 грн |
500+ | 40.05 грн |
PSMN3R0-30YL,115 |
Виробник: Nexperia USA Inc.
Description: MOSFET N-CH 30V 100A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 3mOhm @ 15A, 10V
Power Dissipation (Max): 81W (Tc)
Vgs(th) (Max) @ Id: 2.15V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Part Status: Not For New Designs
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 45.8 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2822 pF @ 12 V
Description: MOSFET N-CH 30V 100A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 3mOhm @ 15A, 10V
Power Dissipation (Max): 81W (Tc)
Vgs(th) (Max) @ Id: 2.15V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Part Status: Not For New Designs
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 45.8 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2822 pF @ 12 V
на замовлення 40500 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1500+ | 36.11 грн |
3000+ | 32.73 грн |
7500+ | 31.17 грн |
10500+ | 27.9 грн |
127-41-652-41-002000 |
Виробник: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
IC & Component Sockets DIP Dual In Line Socket
товар відсутній
127-41-652-41-002000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
127-41-652-41-003000 |
Виробник: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
IC & Component Sockets DIP Dual In Line Socket
товар відсутній
127-41-652-41-003000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
127-41-656-41-002000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 56 (2 x 28)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 56 (2 x 28)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
127-41-656-41-002000 |
Виробник: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
IC & Component Sockets DIP Dual In Line Socket
товар відсутній
127-41-656-41-003000 |
Виробник: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
IC & Component Sockets DIP Dual In Line Socket
товар відсутній
127-41-656-41-003000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 56 (2 x 28)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 56 (2 x 28)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній