558-10-504M29-001101 Preci-Dip
Виробник: Preci-Dip
Description: PGA SOLDER TAIL 1.27MM
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 504 (29 x 29)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: PGA SOLDER TAIL 1.27MM
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 504 (29 x 29)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
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Технічний опис 558-10-504M29-001101 Preci-Dip
Description: PGA SOLDER TAIL 1.27MM, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: PGA, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 504 (29 x 29), Termination: Solder, Housing Material: FR4 Epoxy Glass, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.050" (1.27mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Brass.