CXP-3R0106R-TWQ Zhi Feng Wei Technology
Виробник: Zhi Feng Wei Technology
Description: 10*30 3.0V 10F EDLC
Packaging: Bag
Package / Case: Radial, Can
Size / Dimension: 0.394" Dia (10.00mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 65°C
Lead Spacing: 0.209" (5.30mm)
Termination: PC Pins
ESR (Equivalent Series Resistance): 45mOhm @ 1kHz
Height - Seated (Max): 1.260" (32.00mm)
Part Status: Active
Capacitance: 10 F
Voltage - Rated: 3 V
Description: 10*30 3.0V 10F EDLC
Packaging: Bag
Package / Case: Radial, Can
Size / Dimension: 0.394" Dia (10.00mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 65°C
Lead Spacing: 0.209" (5.30mm)
Termination: PC Pins
ESR (Equivalent Series Resistance): 45mOhm @ 1kHz
Height - Seated (Max): 1.260" (32.00mm)
Part Status: Active
Capacitance: 10 F
Voltage - Rated: 3 V
на замовлення 201 шт:
термін постачання 21-31 дні (днів)
Кількість | Ціна без ПДВ |
---|---|
2+ | 218.64 грн |
10+ | 161.89 грн |
50+ | 146.25 грн |
100+ | 118.1 грн |
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Технічний опис CXP-3R0106R-TWQ Zhi Feng Wei Technology
Description: 10*30 3.0V 10F EDLC, Packaging: Bag, Package / Case: Radial, Can, Size / Dimension: 0.394" Dia (10.00mm), Mounting Type: Through Hole, Operating Temperature: -40°C ~ 65°C, Lead Spacing: 0.209" (5.30mm), Termination: PC Pins, ESR (Equivalent Series Resistance): 45mOhm @ 1kHz, Height - Seated (Max): 1.260" (32.00mm), Part Status: Active, Capacitance: 10 F, Voltage - Rated: 3 V.