DE01064 Dreyer Electronics LLC
Виробник: Dreyer Electronics LLCDescription: QFP-64/TQFP-64/LQFP-64 TO DIP-64
Packaging: Bag
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LQFP, QFP, TQFP
Part Status: Active
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Технічний опис DE01064 Dreyer Electronics LLC
Description: QFP-64/TQFP-64/LQFP-64 TO DIP-64, Packaging: Bag, Material: FR4 Epoxy Glass, Number of Positions: 64, Pitch: 0.100" (2.54mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: SMD to DIP, Package Accepted: LQFP, QFP, TQFP, Part Status: Active.