DE02008 Dreyer Electronics LLC
Виробник: Dreyer Electronics LLCDescription: SOP-8/SSOP-8/SOIC-8 TO DIP-8
Packaging: Bag
Size / Dimension: 0.433" L x 0.472" W (11.00mm x 12.00mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC, SOP, SSOP
Part Status: Active
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Технічний опис DE02008 Dreyer Electronics LLC
Description: SOP-8/SSOP-8/SOIC-8 TO DIP-8, Packaging: Bag, Size / Dimension: 0.433" L x 0.472" W (11.00mm x 12.00mm), Material: FR4 Epoxy Glass, Number of Positions: 8, Pitch: 0.100" (2.54mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: SMD to DIP, Package Accepted: SOIC, SOP, SSOP, Part Status: Active.