DIP300T600P06 Chip Quik Inc.
Виробник: Chip Quik Inc.Description: DIP-6 (0.3" BODY) TO DIP-6 (0.6"
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 78 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 85.94 грн |
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Технічний опис DIP300T600P06 Chip Quik Inc.
Description: DIP-6 (0.3" BODY) TO DIP-6 (0.6", Packaging: Bulk, Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm), Material: FR4 Epoxy Glass, Number of Positions: 6, Pitch: 0.100" (2.54mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: DIP to DIP, Part Status: Active.