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DIP300T600P22

DIP300T600P22 Chip Quik Inc.

DIP300T600P22.pdf Виробник: Chip Quik Inc.
Description: DIP-22 (0.3" BODY) TO DIP-22 (0.
Packaging: Bulk
Size / Dimension: 1.100" L x 0.700" W (27.94mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 22
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
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Технічний опис DIP300T600P22 Chip Quik Inc.

Description: DIP-22 (0.3" BODY) TO DIP-22 (0., Packaging: Bulk, Size / Dimension: 1.100" L x 0.700" W (27.94mm x 17.78mm), Material: FR4 Epoxy Glass, Number of Positions: 22, Pitch: 0.100" (2.54mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: DIP to DIP, Part Status: Active.