DR254D254P08F Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: DUAL ROW 2.54MM PITCH 8-PIN FEMA
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Connector to DIP
Package Accepted: 2.54mm Header
Description: DUAL ROW 2.54MM PITCH 8-PIN FEMA
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Connector to DIP
Package Accepted: 2.54mm Header
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Технічний опис DR254D254P08F Chip Quik Inc.
Description: DUAL ROW 2.54MM PITCH 8-PIN FEMA, Packaging: Bulk, Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm), Material: FR4 Epoxy Glass, Number of Positions: 8, Pitch: 0.100" (2.54mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: Connector to DIP, Package Accepted: 2.54mm Header.