MMS-103-02-L-SV-03 Samtec Inc.
Виробник: Samtec Inc.
Description: CONN RCPT 3POS 0.079 GOLD SMD
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 3.9A per Contact
Mounting Type: Surface Mount
Number of Positions: 3
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: 2
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Insulation Height: 0.177" (4.50mm)
Number of Rows: 1
Description: CONN RCPT 3POS 0.079 GOLD SMD
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 3.9A per Contact
Mounting Type: Surface Mount
Number of Positions: 3
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: 2
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Insulation Height: 0.177" (4.50mm)
Number of Rows: 1
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Технічний опис MMS-103-02-L-SV-03 Samtec Inc.
Description: CONN RCPT 3POS 0.079 GOLD SMD, Packaging: Bulk, Connector Type: Receptacle, Current Rating (Amps): 3.9A per Contact, Mounting Type: Surface Mount, Number of Positions: 3, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: 2, Termination: Solder, Insulation Color: Black, Pitch - Mating: 0.079" (2.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Tin, Insulation Height: 0.177" (4.50mm), Number of Rows: 1.