NC191LTA250 Chip Quik Inc.
Виробник: Chip Quik Inc.Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
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Технічний опис NC191LTA250 Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST, Packaging: Bulk, Composition: Bi57Sn42Ag1 (57/42/1), Type: Solder Paste, Melting Point: 279°F (137°C), Form: Jar, 8.8 oz (250g), Mesh Type: 4, Flux Type: No-Clean, Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C), Shelf Life Start: Date of Manufacture, Shelf Life: 12 Months.