NC191SNL250T5 Chip Quik Inc.
Виробник: Chip Quik Inc.Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
Відгуки про товар
Написати відгук
Технічний опис NC191SNL250T5 Chip Quik Inc.
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS, Packaging: Bulk, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Type: Solder Paste, Melting Point: 422 ~ 428°F (217 ~ 220°C), Form: Jar, 8.8 oz (250g), Mesh Type: 5, Process: Lead Free, Flux Type: No-Clean, Part Status: Active, Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C), Shelf Life Start: Date of Manufacture, Shelf Life: 6 Months.