QFSS-032-04.25-L-D-DP-PC4 Samtec Inc.
Виробник: Samtec Inc.
Description: CONN DIFF ARRAY RCP 64P SMD GOLD
Packaging: Tray
Features: Board Guide, Ground Bus (Plane), Power Pins (8), Shielded
Connector Type: Differential Pair Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 72 (64 + 8 Power)
Pitch: 0.025" (0.64mm)
Height Above Board: 0.278" (7.06mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 11mm
Number of Rows: 2
Description: CONN DIFF ARRAY RCP 64P SMD GOLD
Packaging: Tray
Features: Board Guide, Ground Bus (Plane), Power Pins (8), Shielded
Connector Type: Differential Pair Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 72 (64 + 8 Power)
Pitch: 0.025" (0.64mm)
Height Above Board: 0.278" (7.06mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 11mm
Number of Rows: 2
на замовлення 506 шт:
термін постачання 21-31 дні (днів)
Кількість | Ціна без ПДВ |
---|---|
1+ | 1366.68 грн |
10+ | 1140.1 грн |
25+ | 1080.55 грн |
40+ | 999.36 грн |
80+ | 881.78 грн |
230+ | 823 грн |
440+ | 792.17 грн |
Відгуки про товар
Написати відгук
Технічний опис QFSS-032-04.25-L-D-DP-PC4 Samtec Inc.
Description: CONN DIFF ARRAY RCP 64P SMD GOLD, Packaging: Tray, Features: Board Guide, Ground Bus (Plane), Power Pins (8), Shielded, Connector Type: Differential Pair Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 72 (64 + 8 Power), Pitch: 0.025" (0.64mm), Height Above Board: 0.278" (7.06mm), Contact Finish Thickness: 10.0µin (0.25µm), Mated Stacking Heights: 11mm, Number of Rows: 2.