QTE-028-08-F-D-DP Samtec Inc.
Виробник: Samtec Inc.
Description: CONN DIFF ARRAY PLG 56P SMD GOLD
Features: Ground Bus (Plane)
Packaging: Bulk
Connector Type: Differential Pair Array, Male
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 56
Pitch: 0.031" (0.80mm)
Height Above Board: 1.151" (29.24mm)
Contact Finish Thickness: 3.00µin (0.076µm)
Number of Rows: 2
Description: CONN DIFF ARRAY PLG 56P SMD GOLD
Features: Ground Bus (Plane)
Packaging: Bulk
Connector Type: Differential Pair Array, Male
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 56
Pitch: 0.031" (0.80mm)
Height Above Board: 1.151" (29.24mm)
Contact Finish Thickness: 3.00µin (0.076µm)
Number of Rows: 2
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Технічний опис QTE-028-08-F-D-DP Samtec Inc.
Description: CONN DIFF ARRAY PLG 56P SMD GOLD, Features: Ground Bus (Plane), Packaging: Bulk, Connector Type: Differential Pair Array, Male, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 56, Pitch: 0.031" (0.80mm), Height Above Board: 1.151" (29.24mm), Contact Finish Thickness: 3.00µin (0.076µm), Number of Rows: 2.