R7F701377EAFP-C#BA2 Renesas Electronics America Inc
Виробник: Renesas Electronics America Inc
Description: 32BIT MCU
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 150°C
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: RH850G3M
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSI, FlexRay, LINbus, PSI5, SCI, SENT, UART/USART
Peripherals: DMA, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 144-LFQFP (16x16)
Part Status: Active
Number of I/O: 86
Description: 32BIT MCU
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 150°C
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: RH850G3M
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSI, FlexRay, LINbus, PSI5, SCI, SENT, UART/USART
Peripherals: DMA, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 144-LFQFP (16x16)
Part Status: Active
Number of I/O: 86
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Технічний опис R7F701377EAFP-C#BA2 Renesas Electronics America Inc
Description: 32BIT MCU, Packaging: Tray, Package / Case: 144-LQFP, Mounting Type: Surface Mount, Speed: 160MHz, Program Memory Size: 2MB (2M x 8), RAM Size: 192K x 8, Operating Temperature: -40°C ~ 150°C, Oscillator Type: Internal, Program Memory Type: FLASH, EEPROM Size: 64K x 8, Core Processor: RH850G3M, Data Converters: A/D 24x12b, Core Size: 32-Bit Dual-Core, Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V, Connectivity: CANbus, CSI, FlexRay, LINbus, PSI5, SCI, SENT, UART/USART, Peripherals: DMA, POR, PWM, Temp Sensor, WDT, Supplier Device Package: 144-LFQFP (16x16), Part Status: Active, Number of I/O: 86.