R7F701430EABG-C#BC1

R7F701430EABG-C#BC1 Renesas Electronics Corporation


RH850D1L_D1M.pdf Виробник: Renesas Electronics Corporation
Description: IC MCU 32BIT 5MB FLASH 376BGA
Packaging: Tray
Package / Case: 376-BGA
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 5MB (5M x 8)
RAM Size: 3.6M x 8
Operating Temperature: -40°C ~ 150°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: RH850G3M
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 376-BGA (23x23)
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Технічний опис R7F701430EABG-C#BC1 Renesas Electronics Corporation

Description: IC MCU 32BIT 5MB FLASH 376BGA, Packaging: Tray, Package / Case: 376-BGA, Mounting Type: Surface Mount, Speed: 240MHz, Program Memory Size: 5MB (5M x 8), RAM Size: 3.6M x 8, Operating Temperature: -40°C ~ 150°C (TJ), Oscillator Type: Internal, Program Memory Type: FLASH, EEPROM Size: 64K x 8, Core Processor: RH850G3M, Data Converters: A/D 16x12b, Core Size: 32-Bit, Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V, Connectivity: CANbus, EBI/EMI, Ethernet, I²C, LINbus, SCI, SPI, SSI, UART/USART, USB, Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT, Supplier Device Package: 376-BGA (23x23).