R7F7015973AFP-C#BA3

R7F7015973AFP-C#BA3 Renesas Electronics Corporation


rh850f1k-group-users-manual-hardware?r=1170166 Виробник: Renesas Electronics Corporation
Description: 32BIT MCU RH850/F1K 1M QFP176 10
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: RH850G3KH
Data Converters: A/D 28x10b, 32x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 176-LFQFP (24x24)
Grade: Automotive
Number of I/O: 150
Qualification: AEC-Q100
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Технічний опис R7F7015973AFP-C#BA3 Renesas Electronics Corporation

Description: 32BIT MCU RH850/F1K 1M QFP176 10, Packaging: Tray, Package / Case: 176-LQFP, Mounting Type: Surface Mount, Speed: 120MHz, Program Memory Size: 1MB (1M x 8), RAM Size: 128K x 8, Operating Temperature: -40°C ~ 105°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, EEPROM Size: 64K x 8, Core Processor: RH850G3KH, Data Converters: A/D 28x10b, 32x12b, Core Size: 32-Bit, Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V, Connectivity: CANbus, CSI, I2C, LINbus, SPI, UART/USART, Peripherals: DMA, PWM, WDT, Supplier Device Package: 176-LFQFP (24x24), Grade: Automotive, Number of I/O: 150, Qualification: AEC-Q100.