R8A774C0HA01BG#G0 Renesas Electronics Corporation
Виробник: Renesas Electronics CorporationDescription: IC MPU RZ/G2E 1.2GHZ 552FBGA
Packaging: Tray
Package / Case: 552-FBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 552-FBGA (21x21)
Ethernet: 10/100Mbps (1), 100/1000Mbps (1)
USB: USB 2.0 (1), USB 3.0 (1)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3L
Graphics Acceleration: No
Display & Interface Controllers: MIPI-CSI
Additional Interfaces: CAN, I2C, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
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Технічний опис R8A774C0HA01BG#G0 Renesas Electronics Corporation
Description: IC MPU RZ/G2E 1.2GHZ 552FBGA, Packaging: Tray, Package / Case: 552-FBGA, Mounting Type: Surface Mount, Speed: 1.2GHz, Operating Temperature: -40°C ~ 85°C (TA), Core Processor: ARM® Cortex®-A53, Supplier Device Package: 552-FBGA (21x21), Ethernet: 10/100Mbps (1), 100/1000Mbps (1), USB: USB 2.0 (1), USB 3.0 (1), Number of Cores/Bus Width: 2 Core, 64-Bit, Co-Processors/DSP: Multimedia; NEON™ MPE, RAM Controllers: DDR3L, Graphics Acceleration: No, Display & Interface Controllers: MIPI-CSI, Additional Interfaces: CAN, I2C, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI.