S6E2HG4F0AGV2000M Infineon Technologies
Виробник: Infineon TechnologiesDescription: MULTI-MARKET MCUS
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 288KB (288K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I²C, LINbus, SD, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 80
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Технічний опис S6E2HG4F0AGV2000M Infineon Technologies
Description: MULTI-MARKET MCUS, Packaging: Tray, Package / Case: 100-LQFP, Mounting Type: Surface Mount, Speed: 160MHz, Program Memory Size: 288KB (288K x 8), RAM Size: 32K x 8, Operating Temperature: -40°C ~ 125°C (TA), Oscillator Type: External, Internal, Program Memory Type: FLASH, Core Processor: ARM® Cortex®-M4F, Data Converters: A/D 24x12b SAR; D/A 2x12b, Core Size: 32-Bit, Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V, Connectivity: CANbus, CSIO, EBI/EMI, I²C, LINbus, SD, SPI, UART/USART, Peripherals: DMA, LVD, POR, PWM, WDT, Supplier Device Package: 100-LQFP (14x14), Part Status: Active, Number of I/O: 80.