S912XDG128F2MAL557 NXP USA Inc.
Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 16 BIT, HCS12 C
Packaging: Bulk
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: MICROCONTROLLER, 16 BIT, HCS12 C
Packaging: Bulk
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
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Технічний опис S912XDG128F2MAL557 NXP USA Inc.
Description: MICROCONTROLLER, 16 BIT, HCS12 C, Packaging: Bulk, Package / Case: 112-LQFP, Mounting Type: Surface Mount, Speed: 80MHz, Program Memory Size: 128KB (128K x 8), RAM Size: 12K x 8, Operating Temperature: -40°C ~ 125°C (TA), Oscillator Type: External, Program Memory Type: FLASH, EEPROM Size: 2K x 8, Core Processor: HCS12X, Data Converters: A/D 8x10b, 16x10b, Core Size: 16-Bit, Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V, Connectivity: CANbus, I²C, SCI, SPI, Peripherals: LVD, POR, PWM, WDT, Supplier Device Package: 112-LQFP (20x20), Part Status: Active, Number of I/O: 91, DigiKey Programmable: Not Verified.