SBB2802P-1 Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: SOLDER-IN BREADBOARD 1X3" (28 RO
Packaging: Bulk
Size / Dimension: 3.00" L x 1.00" W (76.2mm x 25.4mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Part Status: Active
Description: SOLDER-IN BREADBOARD 1X3" (28 RO
Packaging: Bulk
Size / Dimension: 3.00" L x 1.00" W (76.2mm x 25.4mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Part Status: Active
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Технічний опис SBB2802P-1 Chip Quik Inc.
Description: SOLDER-IN BREADBOARD 1X3" (28 RO, Packaging: Bulk, Size / Dimension: 3.00" L x 1.00" W (76.2mm x 25.4mm), Pitch: 0.1" (2.54mm) Grid, Board Thickness: 0.063" (1.60mm), Proto Board Type: Breadboard, General Purpose, Hole Diameter: 0.039" (1.00mm), Circuit Pattern: Pad Per Hole (Round), Plating: Plated Through Hole (PTH), Part Status: Active.