TE0720-03-61Q33ML Trenz Electronic GmbH
Виробник: Trenz Electronic GmbHDescription: IC SOC MODULE XILINX ZYNQ
Packaging: Bulk
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 1GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Flash Size: 8GB
Part Status: Discontinued at Digi-Key
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Технічний опис TE0720-03-61Q33ML Trenz Electronic GmbH
Description: IC SOC MODULE XILINX ZYNQ, Packaging: Bulk, Connector Type: Samtec LSHM, Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm), RAM Size: 1GB, Operating Temperature: -40°C ~ 85°C, Module/Board Type: MCU, FPGA, Core Processor: ARM Cortex-A9, Co-Processor: Zynq-7000 (Z-7020), Flash Size: 8GB, Part Status: Discontinued at Digi-Key.