TE0808-04-6BE21-L Trenz Electronic GmbH
Виробник: Trenz Electronic GmbHDescription: IC MOD SOM MPSOC 4GB XCZU6EG
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E
Flash Size: 128MB
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Технічний опис TE0808-04-6BE21-L Trenz Electronic GmbH
Description: IC MOD SOM MPSOC 4GB XCZU6EG, Packaging: Bulk, Connector Type: B2B, Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm), RAM Size: 4GB, Operating Temperature: 0°C ~ 85°C, Module/Board Type: MPU Core, Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E, Flash Size: 128MB.