TE0813-01-3AE11-A Trenz Electronic GmbH
Виробник: Trenz Electronic GmbH
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU3CG-1SFVC784E
Flash Size: 128MB
Part Status: Active
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU3CG-1SFVC784E
Flash Size: 128MB
Part Status: Active
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Технічний опис TE0813-01-3AE11-A Trenz Electronic GmbH
Description: MPSOC MODULE WITH XILINX ZYNQ UL, Packaging: Bulk, Connector Type: Board-to-Board (BTB) Socket - 240, Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm), RAM Size: 2GB, Operating Temperature: 0°C ~ 85°C, Module/Board Type: MPU Core, Core Processor: Zynq UltraScale+ XCZU3CG-1SFVC784E, Flash Size: 128MB, Part Status: Active.