TE0813-02-2BE81-A Trenz Electronic GmbH
Виробник: Trenz Electronic GmbH
Description: MPSOC MODULE WITH AMD ZYNQ ULTRA
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 4 x 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E
Flash Size: 128MB
Description: MPSOC MODULE WITH AMD ZYNQ ULTRA
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 4 x 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E
Flash Size: 128MB
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Технічний опис TE0813-02-2BE81-A Trenz Electronic GmbH
Description: MPSOC MODULE WITH AMD ZYNQ ULTRA, Packaging: Bulk, Connector Type: Board-to-Board (BTB) Socket - 4 x 240, Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm), RAM Size: 4GB, Operating Temperature: 0°C ~ 85°C, Module/Board Type: MPU Core, Core Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E, Flash Size: 128MB.