TE0820-05-2BI21ML Trenz Electronic GmbH
Виробник: Trenz Electronic GmbH
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Part Status: Active
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784I
Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Flash Size: 128MB
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Part Status: Active
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784I
Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Flash Size: 128MB
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Технічний опис TE0820-05-2BI21ML Trenz Electronic GmbH
Description: MPSOC MODULE WITH XILINX ZYNQ UL, Packaging: Bulk, Part Status: Active, Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm), RAM Size: 2GB, Operating Temperature: -40°C ~ 85°C, Module/Board Type: MPU Core, Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784I, Co-Processor: ARM® Cortex®-A53, ARM® Cortex®-R5, Flash Size: 128MB.