TE0820-05-3BE21ML Trenz Electronic GmbH
Виробник: Trenz Electronic GmbHDescription: MOD MPSOC 2GB DDR4
Packaging: Bulk
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E
Flash Size: 128MB
Part Status: Active
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Технічний опис TE0820-05-3BE21ML Trenz Electronic GmbH
Description: MOD MPSOC 2GB DDR4, Packaging: Bulk, Connector Type: Pin(s), Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm), RAM Size: 2GB, Operating Temperature: 0°C ~ 85°C, Module/Board Type: MPU Core, Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5, Co-Processor: Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E, Flash Size: 128MB, Part Status: Active.