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W29GL128CH9C Winbond Electronics

w29gl128c_revh v3.0.pdf Виробник: Winbond Electronics
Description: IC FLASH 128MBIT PAR 56TFBGA
Packaging: Tube
Package / Case: 56-TFBGA
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 56-TFBGA (7x9)
Write Cycle Time - Word, Page: 90ns
Memory Interface: Parallel
Memory Organization: 16M x 8, 8M x 16
DigiKey Programmable: Not Verified
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Технічний опис W29GL128CH9C Winbond Electronics

Description: IC FLASH 128MBIT PAR 56TFBGA, Packaging: Tube, Package / Case: 56-TFBGA, Mounting Type: Surface Mount, Memory Size: 128Mbit, Memory Type: Non-Volatile, Operating Temperature: -40°C ~ 85°C (TA), Voltage - Supply: 2.7V ~ 3.6V, Technology: FLASH - NOR, Memory Format: FLASH, Supplier Device Package: 56-TFBGA (7x9), Write Cycle Time - Word, Page: 90ns, Memory Interface: Parallel, Memory Organization: 16M x 8, 8M x 16, DigiKey Programmable: Not Verified.