X66AK2H12XAAW2 Texas Instruments
Виробник: Texas InstrumentsDescription: IC DSP ARM SOC BGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Interface: EBI/EMI, Ethernet, DMA, I²C, Serial RapidIO, SPI, UART/USART, USB 3.0
Type: DSP+ARM®
Operating Temperature: 0°C ~ 85°C (TC)
Non-Volatile Memory: ROM (384kB)
On-Chip RAM: 12.75MB
Voltage - I/O: 0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V
Voltage - Core: Variable
Clock Rate: 1.2GHz
Supplier Device Package: 1517-FCBGA (40x40)
Part Status: Discontinued at Digi-Key
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Технічний опис X66AK2H12XAAW2 Texas Instruments
Description: IC DSP ARM SOC BGA, Packaging: Tray, Package / Case: 1517-BBGA, FCBGA, Mounting Type: Surface Mount, Interface: EBI/EMI, Ethernet, DMA, I²C, Serial RapidIO, SPI, UART/USART, USB 3.0, Type: DSP+ARM®, Operating Temperature: 0°C ~ 85°C (TC), Non-Volatile Memory: ROM (384kB), On-Chip RAM: 12.75MB, Voltage - I/O: 0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V, Voltage - Core: Variable, Clock Rate: 1.2GHz, Supplier Device Package: 1517-FCBGA (40x40), Part Status: Discontinued at Digi-Key.