XC2299H200F100LABKXUMA1 Infineon Technologies
Виробник: Infineon TechnologiesDescription: IC MCU 16/32B 1.6MB FLSH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 1.6MB (1.6M x 8)
RAM Size: 138K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 30x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: DMA, I2S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-176-12
Part Status: Not For New Designs
Number of I/O: 150
DigiKey Programmable: Not Verified
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Технічний опис XC2299H200F100LABKXUMA1 Infineon Technologies
Description: IC MCU 16/32B 1.6MB FLSH 176LQFP, Packaging: Tape & Reel (TR), Package / Case: 176-LQFP Exposed Pad, Mounting Type: Surface Mount, Speed: 100MHz, Program Memory Size: 1.6MB (1.6M x 8), RAM Size: 138K x 8, Operating Temperature: -40°C ~ 125°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, Core Processor: C166SV2, Data Converters: A/D 30x10b, Core Size: 16/32-Bit, Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V, Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI, Peripherals: DMA, I2S, POR, PWM, WDT, Supplier Device Package: PG-LQFP-176-12, Part Status: Not For New Designs, Number of I/O: 150, DigiKey Programmable: Not Verified.