Продукція > TRENZ ELECTRONIC GMBH > Всі товари виробника TRENZ ELECTRONIC GMBH (544) > Сторінка 7 з 10
| Фото | Назва | Виробник | Інформація |
Доступність |
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| TE0745-02-93E11-A | Trenz Electronic GmbH |
 Description: IC MOD SOM DDR3L 1GB ZYNQ |
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| TE0745-02-93E11-KA | Trenz Electronic GmbH | Description: MOD SOM DDR3L 1GB |
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| TE0745-02-93E31-A | Trenz Electronic GmbH | Description: MOD SOM DDR3L 1GB |
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| TE0745-02-93E31-AK | Trenz Electronic GmbH |
Description: SOM WITH XILINX ZYNQ 7045-3E AND Packaging: Bulk Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) RAM Size: 1GB Operating Temperature: -40°C ~ 85°C Module/Board Type: MPU Core Co-Processor: ARM Cortex-A9 Flash Size: 64MB Part Status: Active |
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| TE0745-03-71I31-AK | Trenz Electronic GmbH |
Description: SOM WITH AMD ZYNQ 7030-1I AND HE Packaging: Bulk Connector Type: Samtec ST5 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) RAM Size: 1GB Operating Temperature: -40°C ~ 85°C Module/Board Type: MPU Core Core Processor: ARM Cortex-A9 Co-Processor: Xilinx Zynq 7030 SoC XC7Z030-1FBG676I Flash Size: 64MB |
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| TE0745-03-81C31-A | Trenz Electronic GmbH |
Description: MOD SOM DDR3L 1GB Packaging: Bulk Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 2.047" L x 2.992" W (52.00mm x 76.00mm) RAM Size: 1GB Operating Temperature: 0°C ~ 70°C Module/Board Type: FPGA Core Processor: ARM® Cortex®-A9 Co-Processor: Xilinx Zynq 7035 SoC XC7Z035-1FBG676C Flash Size: 64MB |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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| TE0745-03-82I31-A | Trenz Electronic GmbH |
Description: SOM WITH AMD ZYNQ 7035-2I, 1 GBY Packaging: Bulk Connector Type: Board-to-Board (BTB) Socket - 250 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) RAM Size: 1GB Operating Temperature: -40°C ~ 85°C Module/Board Type: MPU Core Core Processor: ARM Cortex-A9 Co-Processor: Xilinx Zynq 7035 SoC XC7Z035-2FBG676I Flash Size: 64MB |
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| TE0745-03-91C31-A | Trenz Electronic GmbH |
Description: SOM WITH AMD ZYNQ 7045-1C, 1 GBY Packaging: Bulk Connector Type: Samtec ST5 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) RAM Size: 1GB Operating Temperature: 0°C ~ 70°C Module/Board Type: MPU Core Core Processor: ARM Cortex-A9 Co-Processor: Xilinx Zynq 7045 SoC XC7Z045-1FBG676C Flash Size: 64MB |
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| TE0745-03-92I31-A | Trenz Electronic GmbH |
Description: SOM WITH AMD ZYNQ 7045-2I, 1 GBY Packaging: Bulk Connector Type: Samtec ST5 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) RAM Size: 1GB Operating Temperature: -40°C ~ 85°C Module/Board Type: MPU Core Core Processor: ARM Cortex-A9 Co-Processor: Xilinx Zynq 7045 SoC XC7Z045-2FBG676I Flash Size: 64MB |
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TE0782-02-035-2I | Trenz Electronic GmbH |
Description: IC MODULE CORTEX-A9 1GB 32MB |
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TE0782-02-045-2I | Trenz Electronic GmbH |
Description: IC MODULE CORTEX-A9 1GB 32MB |
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| TE0782-02-045-2IC | Trenz Electronic GmbH | Description: IC MODULE CORTEX |
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TE0782-02-100-2I | Trenz Electronic GmbH |
Description: IC MODULE CORTEX-A9 1GB 32MB |
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| TE0782-02-92I33FA | Trenz Electronic GmbH | Description: IC MODULE CORTEX |
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| TE0782-02-92I33FH | Trenz Electronic GmbH | Description: IC MODULE CORTEX |
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| TE0782-02-92I33MA | Trenz Electronic GmbH | Description: IC MODULE CORTEX |
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| TE0783-02-92I33MA | Trenz Electronic GmbH |
Description: HIGH-PERFORMANCE SOM WITH XILINX Packaging: Bulk Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 3.350" L x 3.350" W (85.00mm x 85.00mm) RAM Size: 1GB Operating Temperature: -40°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq™ 7000 XC7Z045-2FFG900I Co-Processor: ARM Cortex-A9 Flash Size: 32MB Part Status: Active |
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TE0790-02 | Trenz Electronic GmbH |
Description: ADAPTER USB JTAG XMOD FTDI 2CH |
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TE0790-02L | Trenz Electronic GmbH |
Description: ADAPTER USB JTAG XMOD FTDI 2CH |
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TE0790-03 | Trenz Electronic GmbH |
Description: ADAPTER USB JTAG Packaging: Bulk For Use With/Related Products: JTAG Devices Type: Programmer (In-Circuit/In-System) Contents: Board(s) |
на замовлення 251 шт: термін постачання 21-31 дні (днів) |
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TE0790-03L | Trenz Electronic GmbH |
Description: ADAPTER XMOD FTDI JTAG Packaging: Bulk For Use With/Related Products: JTAG Devices Type: Programmer (In-Circuit/In-System) Contents: Board(s) Part Status: Active |
на замовлення 55 шт: термін постачання 21-31 дні (днів) |
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TE0791-01 | Trenz Electronic GmbH |
Description: XMOD JTAG CONNECTOR Packaging: Bulk For Use With/Related Products: XMOD JTAG Adapter Accessory Type: Adapter Board |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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TE0803-01-02EG-1EA | Trenz Electronic GmbH |
Description: IC MODULE ZYNQ USCALE 2GB 128MB |
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TE0803-01-03CG-1EA | Trenz Electronic GmbH |
Description: IC MODULE ZYNQ USCALE 2GB 128MB |
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| TE0803-01-04CG-1EA | Trenz Electronic GmbH |
Description: IC MODULE ZYNQ USCALE 2GB 128MB Packaging: Bulk Connector Type: B2B Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) RAM Size: 2GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU4CG-1SFVC784E Flash Size: 128MB |
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| TE0803-02-03EG-1EB | Trenz Electronic GmbH |
Description: IC MODULE ZYNQ USCALE 4GB 128MB Packaging: Bulk Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) RAM Size: 4GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E Flash Size: 128MB |
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| TE0803-02-04CG-1EB | Trenz Electronic GmbH |
Description: IC MODULE ZYNQ USCALE 2GB 256MB Packaging: Bulk Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) RAM Size: 2GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU4CG-1SFVC784E Flash Size: 256MB |
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| TE0803-02-05EV-1EA | Trenz Electronic GmbH |
Description: IC MODULE ZYNQ USCALE 2GB 128MB Packaging: Bulk Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) RAM Size: 2GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU5EV-1SFVC784E Flash Size: 128MB |
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| TE0803-02-05EV-1IA | Trenz Electronic GmbH |
Description: MODULE SOM TE0803-02 Packaging: Bulk Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Module/Board Type: MPU Core |
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| TE0803-03-4AE11-A | Trenz Electronic GmbH |
Description: IC MODULE ZYNQ USCALE 2GB 128MB |
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TE0803-03-4BE11-A | Trenz Electronic GmbH |
Description: IC MODULE ZYNQ USCALE 2GB 128MB |
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| TE0803-03-4BE21-L | Trenz Electronic GmbH | Description: MODULE SOM TE0803-03 |
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| TE0803-03-4BI21-A | Trenz Electronic GmbH | Description: MODULE SOM TE0803-03 |
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| TE0803-03-4DE11-A | Trenz Electronic GmbH |
Description: IC MODULE ZYNQ USCALE 2GB 128MB |
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| TE0803-04-2AE11-A | Trenz Electronic GmbH |
Description: IC MODULE ZYNQ USCALE 2GB 128MB Packaging: Bulk Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) RAM Size: 2GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E Flash Size: 128MB |
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| TE0803-04-2BE11-A | Trenz Electronic GmbH |
Description: IC MODULE ZYNQ USCALE 2GB 128MB Packaging: Bulk Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) RAM Size: 2GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784E Flash Size: 128MB |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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| TE0803-04-3AE11-A | Trenz Electronic GmbH |
Description: IC MODULE ZYNQ USCALE 2GB 128MB Packaging: Bulk Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) RAM Size: 2GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU3CG-1SFVC784E Flash Size: 128MB |
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| TE0803-04-3BE11-A | Trenz Electronic GmbH |
Description: IC MODULE ZYNQ USCALE 2GB 128MB Packaging: Bulk Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) RAM Size: 2GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E Flash Size: 128MB |
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| TE0803-04-4AE11-A | Trenz Electronic GmbH |
Description: IC MODULE ZYNQ USCALE 2GB 128MB Packaging: Bulk Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) RAM Size: 2GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU4CG-1SFVC784E Flash Size: 128MB |
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| TE0803-04-4BE11-A | Trenz Electronic GmbH |
Description: IC MODULE ZYNQ USCALE 2GB 128MB Packaging: Bulk Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) RAM Size: 2GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU4EG-1SFVC784E Flash Size: 128MB |
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| TE0803-04-4DE11-A | Trenz Electronic GmbH |
Description: IC MODULE ZYNQ USCALE 2GB 128MB Packaging: Bulk Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) RAM Size: 2GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU4EV-1SFVC784E Flash Size: 128MB |
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| TE0803-04-4DE21-L | Trenz Electronic GmbH |
Description: IC MODULE ZYNQ USCALE 2GB 128MB Packaging: Bulk Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) RAM Size: 4GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU4EV-1SFVC784E Flash Size: 128MB |
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| TE0803-04-4GE21-L | Trenz Electronic GmbH |
Description: MPSOC MODULE WITH XILINX ZYNQ UL Packaging: Bulk Connector Type: Board-to-Board (BTB) Socket - 160 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) RAM Size: 4GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ XCZU4EG-2SFVC784E Flash Size: 128MB |
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| TE0803-04-5DE11-A | Trenz Electronic GmbH |
Description: IC MODULE ZYNQ USCALE 2GB 128MB Packaging: Bulk Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) RAM Size: 2GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU5EV-1SFVC784E Flash Size: 128MB |
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| TE0803-04-5DI21-A | Trenz Electronic GmbH |
Description: IC MODULE ZYNQ USCALE 2GB 128MB Packaging: Bulk Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) RAM Size: 4GB Operating Temperature: -40°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU5EV-1SFVC784I Flash Size: 128MB |
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| TE0807-02-04EG-1E | Trenz Electronic GmbH | Description: IC MODULE ZYNQ USCALE |
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| TE0807-02-07EV-1E | Trenz Electronic GmbH |
Description: IC MODULE ZYNQ USCALE 4GB 128MB Packaging: Bulk Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) RAM Size: 4GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU7EV-1FBVB900E Flash Size: 128MB |
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| TE0807-02-4BE21-A | Trenz Electronic GmbH | Description: IC MODULE ZYNQ USCALE |
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| TE0807-03-4AI21-A | Trenz Electronic GmbH |
Description: MPSOC ZYNQ USCALE 4GB DDR4 Packaging: Box Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) RAM Size: 4GB Operating Temperature: -40°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU4CG-1FBVB900I Flash Size: 128MB |
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| TE0807-03-4BE21-A | Trenz Electronic GmbH |
Description: MPSOC MODULE WITH XILINX ZYNQ UL Packaging: Bulk Connector Type: Board-to-Board (BTB) Socket - 160 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) RAM Size: 4GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ XCZU4EG-1FBVB900E Flash Size: 128MB |
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| TE0807-03-4BE21-AK | Trenz Electronic GmbH |
Description: MPSOC MODULE TE0807 WITH ZYNQ UL Packaging: Bulk Connector Type: Board-to-Board (BTB) Socket - 160 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) RAM Size: 4GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq™ UltraScale+™ XCZU4EG-1FBVB900E Flash Size: 128MB |
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| TE0807-03-5AI21-A | Trenz Electronic GmbH | Description: MPSOC ZYNQ USCALE 4GB DDR4 |
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| TE0807-03-7AI21-A | Trenz Electronic GmbH | Description: MPSOC ZYNQ USCALE 4GB DDR4 |
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| TE0807-03-7DE21-A | Trenz Electronic GmbH |
Description: MPSOC MODULE WITH XILINX ZYNQ UL Packaging: Bulk Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) RAM Size: 4GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU7EV-1FBVB900E Flash Size: 128MB Part Status: Active |
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| TE0807-03-7DI21-A | Trenz Electronic GmbH | Description: MPSOC ZYNQ USCALE 4GB DDR4 |
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| TE0808-04-06EG-1EE | Trenz Electronic GmbH |
Description: IC MODULE ZYNQ USCALE 4GB 128MB Packaging: Bulk Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) RAM Size: 4GB Operating Temperature: 0°C ~ 85°C Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E Flash Size: 128MB |
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TE0808-04-09-1EE-S | Trenz Electronic GmbH |
Description: TE0808-04-09-1EE-S STARTER KIT Packaging: Bulk For Use With/Related Products: TE0808, XCZU9EG Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Accessories Platform: TE0808 Zynq UltraScale+ MPSoC Carrier Starter Part Status: Obsolete |
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| TE0808-04-09-2IE-S | Trenz Electronic GmbH |
Description: STARTER KIT XILINX USCALE+ SOM Packaging: Bulk For Use With/Related Products: TE0808, XCZU9EG Type: FPGA + MCU/MPU SoC Contents: Board(s) Platform: TE0808 Zynq UltraScale+ MPSoC Carrier Starter Part Status: Obsolete |
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TE0808-04-09EG-1EE | Trenz Electronic GmbH |
Description: IC MODULE ZYNQ USCALE 4GB 128MB |
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TE0808-04-09EG-2IE | Trenz Electronic GmbH |
Description: IC MODULE ZYNQ USCALE 4GB 128MB |
товар відсутній |
| TE0745-02-93E11-A |
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Виробник: Trenz Electronic GmbH
Description: IC MOD SOM DDR3L 1GB ZYNQ
Description: IC MOD SOM DDR3L 1GB ZYNQ
товар відсутній
| TE0745-02-93E31-AK |
Виробник: Trenz Electronic GmbH
Description: SOM WITH XILINX ZYNQ 7045-3E AND
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 1GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Co-Processor: ARM Cortex-A9
Flash Size: 64MB
Part Status: Active
Description: SOM WITH XILINX ZYNQ 7045-3E AND
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 1GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Co-Processor: ARM Cortex-A9
Flash Size: 64MB
Part Status: Active
товар відсутній
| TE0745-03-71I31-AK |
Виробник: Trenz Electronic GmbH
Description: SOM WITH AMD ZYNQ 7030-1I AND HE
Packaging: Bulk
Connector Type: Samtec ST5
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 1GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM Cortex-A9
Co-Processor: Xilinx Zynq 7030 SoC XC7Z030-1FBG676I
Flash Size: 64MB
Description: SOM WITH AMD ZYNQ 7030-1I AND HE
Packaging: Bulk
Connector Type: Samtec ST5
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 1GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM Cortex-A9
Co-Processor: Xilinx Zynq 7030 SoC XC7Z030-1FBG676I
Flash Size: 64MB
товар відсутній
| TE0745-03-81C31-A |
Виробник: Trenz Electronic GmbH
Description: MOD SOM DDR3L 1GB
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 2.047" L x 2.992" W (52.00mm x 76.00mm)
RAM Size: 1GB
Operating Temperature: 0°C ~ 70°C
Module/Board Type: FPGA
Core Processor: ARM® Cortex®-A9
Co-Processor: Xilinx Zynq 7035 SoC XC7Z035-1FBG676C
Flash Size: 64MB
Description: MOD SOM DDR3L 1GB
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 2.047" L x 2.992" W (52.00mm x 76.00mm)
RAM Size: 1GB
Operating Temperature: 0°C ~ 70°C
Module/Board Type: FPGA
Core Processor: ARM® Cortex®-A9
Co-Processor: Xilinx Zynq 7035 SoC XC7Z035-1FBG676C
Flash Size: 64MB
на замовлення 3 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 91991.45 грн |
| TE0745-03-82I31-A |
Виробник: Trenz Electronic GmbH
Description: SOM WITH AMD ZYNQ 7035-2I, 1 GBY
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 250
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 1GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM Cortex-A9
Co-Processor: Xilinx Zynq 7035 SoC XC7Z035-2FBG676I
Flash Size: 64MB
Description: SOM WITH AMD ZYNQ 7035-2I, 1 GBY
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 250
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 1GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM Cortex-A9
Co-Processor: Xilinx Zynq 7035 SoC XC7Z035-2FBG676I
Flash Size: 64MB
товар відсутній
| TE0745-03-91C31-A |
Виробник: Trenz Electronic GmbH
Description: SOM WITH AMD ZYNQ 7045-1C, 1 GBY
Packaging: Bulk
Connector Type: Samtec ST5
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 1GB
Operating Temperature: 0°C ~ 70°C
Module/Board Type: MPU Core
Core Processor: ARM Cortex-A9
Co-Processor: Xilinx Zynq 7045 SoC XC7Z045-1FBG676C
Flash Size: 64MB
Description: SOM WITH AMD ZYNQ 7045-1C, 1 GBY
Packaging: Bulk
Connector Type: Samtec ST5
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 1GB
Operating Temperature: 0°C ~ 70°C
Module/Board Type: MPU Core
Core Processor: ARM Cortex-A9
Co-Processor: Xilinx Zynq 7045 SoC XC7Z045-1FBG676C
Flash Size: 64MB
товар відсутній
| TE0745-03-92I31-A |
Виробник: Trenz Electronic GmbH
Description: SOM WITH AMD ZYNQ 7045-2I, 1 GBY
Packaging: Bulk
Connector Type: Samtec ST5
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 1GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM Cortex-A9
Co-Processor: Xilinx Zynq 7045 SoC XC7Z045-2FBG676I
Flash Size: 64MB
Description: SOM WITH AMD ZYNQ 7045-2I, 1 GBY
Packaging: Bulk
Connector Type: Samtec ST5
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 1GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: ARM Cortex-A9
Co-Processor: Xilinx Zynq 7045 SoC XC7Z045-2FBG676I
Flash Size: 64MB
товар відсутній
| TE0782-02-035-2I |
|
Виробник: Trenz Electronic GmbH
Description: IC MODULE CORTEX-A9 1GB 32MB
Description: IC MODULE CORTEX-A9 1GB 32MB
товар відсутній
| TE0782-02-045-2I |
|
Виробник: Trenz Electronic GmbH
Description: IC MODULE CORTEX-A9 1GB 32MB
Description: IC MODULE CORTEX-A9 1GB 32MB
товар відсутній
| TE0782-02-100-2I |
|
Виробник: Trenz Electronic GmbH
Description: IC MODULE CORTEX-A9 1GB 32MB
Description: IC MODULE CORTEX-A9 1GB 32MB
товар відсутній
| TE0783-02-92I33MA |
Виробник: Trenz Electronic GmbH
Description: HIGH-PERFORMANCE SOM WITH XILINX
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 3.350" L x 3.350" W (85.00mm x 85.00mm)
RAM Size: 1GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq™ 7000 XC7Z045-2FFG900I
Co-Processor: ARM Cortex-A9
Flash Size: 32MB
Part Status: Active
Description: HIGH-PERFORMANCE SOM WITH XILINX
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 3.350" L x 3.350" W (85.00mm x 85.00mm)
RAM Size: 1GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq™ 7000 XC7Z045-2FFG900I
Co-Processor: ARM Cortex-A9
Flash Size: 32MB
Part Status: Active
товар відсутній
| TE0790-02 |
|
Виробник: Trenz Electronic GmbH
Description: ADAPTER USB JTAG XMOD FTDI 2CH
Description: ADAPTER USB JTAG XMOD FTDI 2CH
товар відсутній
| TE0790-02L |
|
Виробник: Trenz Electronic GmbH
Description: ADAPTER USB JTAG XMOD FTDI 2CH
Description: ADAPTER USB JTAG XMOD FTDI 2CH
товар відсутній
| TE0790-03 |
|
Виробник: Trenz Electronic GmbH
Description: ADAPTER USB JTAG
Packaging: Bulk
For Use With/Related Products: JTAG Devices
Type: Programmer (In-Circuit/In-System)
Contents: Board(s)
Description: ADAPTER USB JTAG
Packaging: Bulk
For Use With/Related Products: JTAG Devices
Type: Programmer (In-Circuit/In-System)
Contents: Board(s)
на замовлення 251 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2993.11 грн |
| TE0790-03L |
|
Виробник: Trenz Electronic GmbH
Description: ADAPTER XMOD FTDI JTAG
Packaging: Bulk
For Use With/Related Products: JTAG Devices
Type: Programmer (In-Circuit/In-System)
Contents: Board(s)
Part Status: Active
Description: ADAPTER XMOD FTDI JTAG
Packaging: Bulk
For Use With/Related Products: JTAG Devices
Type: Programmer (In-Circuit/In-System)
Contents: Board(s)
Part Status: Active
на замовлення 55 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2070.36 грн |
| TE0791-01 |
|
Виробник: Trenz Electronic GmbH
Description: XMOD JTAG CONNECTOR
Packaging: Bulk
For Use With/Related Products: XMOD JTAG Adapter
Accessory Type: Adapter Board
Description: XMOD JTAG CONNECTOR
Packaging: Bulk
For Use With/Related Products: XMOD JTAG Adapter
Accessory Type: Adapter Board
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 585.48 грн |
| TE0803-01-02EG-1EA |
|
Виробник: Trenz Electronic GmbH
Description: IC MODULE ZYNQ USCALE 2GB 128MB
Description: IC MODULE ZYNQ USCALE 2GB 128MB
товар відсутній
| TE0803-01-03CG-1EA |
|
Виробник: Trenz Electronic GmbH
Description: IC MODULE ZYNQ USCALE 2GB 128MB
Description: IC MODULE ZYNQ USCALE 2GB 128MB
товар відсутній
| TE0803-01-04CG-1EA |
|
Виробник: Trenz Electronic GmbH
Description: IC MODULE ZYNQ USCALE 2GB 128MB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU4CG-1SFVC784E
Flash Size: 128MB
Description: IC MODULE ZYNQ USCALE 2GB 128MB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU4CG-1SFVC784E
Flash Size: 128MB
товар відсутній
| TE0803-02-03EG-1EB |
|
Виробник: Trenz Electronic GmbH
Description: IC MODULE ZYNQ USCALE 4GB 128MB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
Flash Size: 128MB
Description: IC MODULE ZYNQ USCALE 4GB 128MB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
Flash Size: 128MB
товар відсутній
| TE0803-02-04CG-1EB |
|
Виробник: Trenz Electronic GmbH
Description: IC MODULE ZYNQ USCALE 2GB 256MB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU4CG-1SFVC784E
Flash Size: 256MB
Description: IC MODULE ZYNQ USCALE 2GB 256MB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU4CG-1SFVC784E
Flash Size: 256MB
товар відсутній
| TE0803-02-05EV-1EA |
Виробник: Trenz Electronic GmbH
Description: IC MODULE ZYNQ USCALE 2GB 128MB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU5EV-1SFVC784E
Flash Size: 128MB
Description: IC MODULE ZYNQ USCALE 2GB 128MB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU5EV-1SFVC784E
Flash Size: 128MB
товар відсутній
| TE0803-02-05EV-1IA |
Виробник: Trenz Electronic GmbH
Description: MODULE SOM TE0803-02
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Module/Board Type: MPU Core
Description: MODULE SOM TE0803-02
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Module/Board Type: MPU Core
товар відсутній
| TE0803-03-4AE11-A |
|
Виробник: Trenz Electronic GmbH
Description: IC MODULE ZYNQ USCALE 2GB 128MB
Description: IC MODULE ZYNQ USCALE 2GB 128MB
товар відсутній
| TE0803-03-4BE11-A |
|
Виробник: Trenz Electronic GmbH
Description: IC MODULE ZYNQ USCALE 2GB 128MB
Description: IC MODULE ZYNQ USCALE 2GB 128MB
товар відсутній
| TE0803-03-4DE11-A |
|
Виробник: Trenz Electronic GmbH
Description: IC MODULE ZYNQ USCALE 2GB 128MB
Description: IC MODULE ZYNQ USCALE 2GB 128MB
товар відсутній
| TE0803-04-2AE11-A |
|
Виробник: Trenz Electronic GmbH
Description: IC MODULE ZYNQ USCALE 2GB 128MB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E
Flash Size: 128MB
Description: IC MODULE ZYNQ USCALE 2GB 128MB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E
Flash Size: 128MB
товар відсутній
| TE0803-04-2BE11-A |
|
Виробник: Trenz Electronic GmbH
Description: IC MODULE ZYNQ USCALE 2GB 128MB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784E
Flash Size: 128MB
Description: IC MODULE ZYNQ USCALE 2GB 128MB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784E
Flash Size: 128MB
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 26020.36 грн |
| TE0803-04-3AE11-A |
|
Виробник: Trenz Electronic GmbH
Description: IC MODULE ZYNQ USCALE 2GB 128MB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU3CG-1SFVC784E
Flash Size: 128MB
Description: IC MODULE ZYNQ USCALE 2GB 128MB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU3CG-1SFVC784E
Flash Size: 128MB
товар відсутній
| TE0803-04-3BE11-A |
|
Виробник: Trenz Electronic GmbH
Description: IC MODULE ZYNQ USCALE 2GB 128MB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
Flash Size: 128MB
Description: IC MODULE ZYNQ USCALE 2GB 128MB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
Flash Size: 128MB
товар відсутній
| TE0803-04-4AE11-A |
|
Виробник: Trenz Electronic GmbH
Description: IC MODULE ZYNQ USCALE 2GB 128MB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU4CG-1SFVC784E
Flash Size: 128MB
Description: IC MODULE ZYNQ USCALE 2GB 128MB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU4CG-1SFVC784E
Flash Size: 128MB
товар відсутній
| TE0803-04-4BE11-A |
|
Виробник: Trenz Electronic GmbH
Description: IC MODULE ZYNQ USCALE 2GB 128MB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU4EG-1SFVC784E
Flash Size: 128MB
Description: IC MODULE ZYNQ USCALE 2GB 128MB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU4EG-1SFVC784E
Flash Size: 128MB
товар відсутній
| TE0803-04-4DE11-A |
|
Виробник: Trenz Electronic GmbH
Description: IC MODULE ZYNQ USCALE 2GB 128MB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU4EV-1SFVC784E
Flash Size: 128MB
Description: IC MODULE ZYNQ USCALE 2GB 128MB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU4EV-1SFVC784E
Flash Size: 128MB
товар відсутній
| TE0803-04-4DE21-L |
|
Виробник: Trenz Electronic GmbH
Description: IC MODULE ZYNQ USCALE 2GB 128MB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU4EV-1SFVC784E
Flash Size: 128MB
Description: IC MODULE ZYNQ USCALE 2GB 128MB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU4EV-1SFVC784E
Flash Size: 128MB
товар відсутній
| TE0803-04-4GE21-L |
Виробник: Trenz Electronic GmbH
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 160
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ XCZU4EG-2SFVC784E
Flash Size: 128MB
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 160
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ XCZU4EG-2SFVC784E
Flash Size: 128MB
товар відсутній
| TE0803-04-5DE11-A |
|
Виробник: Trenz Electronic GmbH
Description: IC MODULE ZYNQ USCALE 2GB 128MB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU5EV-1SFVC784E
Flash Size: 128MB
Description: IC MODULE ZYNQ USCALE 2GB 128MB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 2GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU5EV-1SFVC784E
Flash Size: 128MB
товар відсутній
| TE0803-04-5DI21-A |
|
Виробник: Trenz Electronic GmbH
Description: IC MODULE ZYNQ USCALE 2GB 128MB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 4GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU5EV-1SFVC784I
Flash Size: 128MB
Description: IC MODULE ZYNQ USCALE 2GB 128MB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 4GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU5EV-1SFVC784I
Flash Size: 128MB
товар відсутній
| TE0807-02-07EV-1E |
|
Виробник: Trenz Electronic GmbH
Description: IC MODULE ZYNQ USCALE 4GB 128MB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU7EV-1FBVB900E
Flash Size: 128MB
Description: IC MODULE ZYNQ USCALE 4GB 128MB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU7EV-1FBVB900E
Flash Size: 128MB
товар відсутній
| TE0807-03-4AI21-A |
|
Виробник: Trenz Electronic GmbH
Description: MPSOC ZYNQ USCALE 4GB DDR4
Packaging: Box
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 4GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU4CG-1FBVB900I
Flash Size: 128MB
Description: MPSOC ZYNQ USCALE 4GB DDR4
Packaging: Box
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 4GB
Operating Temperature: -40°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU4CG-1FBVB900I
Flash Size: 128MB
товар відсутній
| TE0807-03-4BE21-A |
Виробник: Trenz Electronic GmbH
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 160
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ XCZU4EG-1FBVB900E
Flash Size: 128MB
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 160
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ XCZU4EG-1FBVB900E
Flash Size: 128MB
товар відсутній
| TE0807-03-4BE21-AK |
Виробник: Trenz Electronic GmbH
Description: MPSOC MODULE TE0807 WITH ZYNQ UL
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 160
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ XCZU4EG-1FBVB900E
Flash Size: 128MB
Description: MPSOC MODULE TE0807 WITH ZYNQ UL
Packaging: Bulk
Connector Type: Board-to-Board (BTB) Socket - 160
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq™ UltraScale+™ XCZU4EG-1FBVB900E
Flash Size: 128MB
товар відсутній
| TE0807-03-5AI21-A |
Виробник: Trenz Electronic GmbH
Description: MPSOC ZYNQ USCALE 4GB DDR4
Description: MPSOC ZYNQ USCALE 4GB DDR4
товар відсутній
| TE0807-03-7AI21-A |
Виробник: Trenz Electronic GmbH
Description: MPSOC ZYNQ USCALE 4GB DDR4
Description: MPSOC ZYNQ USCALE 4GB DDR4
товар відсутній
| TE0807-03-7DE21-A |
Виробник: Trenz Electronic GmbH
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU7EV-1FBVB900E
Flash Size: 128MB
Part Status: Active
Description: MPSOC MODULE WITH XILINX ZYNQ UL
Packaging: Bulk
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU7EV-1FBVB900E
Flash Size: 128MB
Part Status: Active
товар відсутній
| TE0807-03-7DI21-A |
Виробник: Trenz Electronic GmbH
Description: MPSOC ZYNQ USCALE 4GB DDR4
Description: MPSOC ZYNQ USCALE 4GB DDR4
товар відсутній
| TE0808-04-06EG-1EE |
|
Виробник: Trenz Electronic GmbH
Description: IC MODULE ZYNQ USCALE 4GB 128MB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E
Flash Size: 128MB
Description: IC MODULE ZYNQ USCALE 4GB 128MB
Packaging: Bulk
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C
Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E
Flash Size: 128MB
товар відсутній
| TE0808-04-09-1EE-S |
|
Виробник: Trenz Electronic GmbH
Description: TE0808-04-09-1EE-S STARTER KIT
Packaging: Bulk
For Use With/Related Products: TE0808, XCZU9EG
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories
Platform: TE0808 Zynq UltraScale+ MPSoC Carrier Starter
Part Status: Obsolete
Description: TE0808-04-09-1EE-S STARTER KIT
Packaging: Bulk
For Use With/Related Products: TE0808, XCZU9EG
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories
Platform: TE0808 Zynq UltraScale+ MPSoC Carrier Starter
Part Status: Obsolete
товар відсутній
| TE0808-04-09-2IE-S |
|
Виробник: Trenz Electronic GmbH
Description: STARTER KIT XILINX USCALE+ SOM
Packaging: Bulk
For Use With/Related Products: TE0808, XCZU9EG
Type: FPGA + MCU/MPU SoC
Contents: Board(s)
Platform: TE0808 Zynq UltraScale+ MPSoC Carrier Starter
Part Status: Obsolete
Description: STARTER KIT XILINX USCALE+ SOM
Packaging: Bulk
For Use With/Related Products: TE0808, XCZU9EG
Type: FPGA + MCU/MPU SoC
Contents: Board(s)
Platform: TE0808 Zynq UltraScale+ MPSoC Carrier Starter
Part Status: Obsolete
товар відсутній
| TE0808-04-09EG-1EE |
|
Виробник: Trenz Electronic GmbH
Description: IC MODULE ZYNQ USCALE 4GB 128MB
Description: IC MODULE ZYNQ USCALE 4GB 128MB
товар відсутній
| TE0808-04-09EG-2IE |
|
Виробник: Trenz Electronic GmbH
Description: IC MODULE ZYNQ USCALE 4GB 128MB
Description: IC MODULE ZYNQ USCALE 4GB 128MB
товар відсутній