Продукція > BOYD LACONIA, LLC > Всі товари виробника BOYD LACONIA, LLC (446) > Сторінка 1 з 8
| Фото | Назва | Виробник | Інформація |
Доступність |
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| 0015-35035A | Boyd Laconia, LLC |
Description: 0015-35035A,REV A,00,04 Packaging: Bulk |
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| 0S517-100-B | Boyd Laconia, LLC |
Description: 0S517-100-B Packaging: Bulk |
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| 0SY76-127-B | Boyd Laconia, LLC |
Description: FG-HTSK-AL-0SY76-127-B, ROHS COM Packaging: Bulk |
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| 100000F00000G | Boyd Laconia, LLC |
Description: THERMAL PASTE Packaging: Bulk Color: White Size / Dimension: 1 gram Ampule Type: Silicone Compound Thermal Conductivity: 0.73W/m-K Shelf Life: 24 Months Usable Temperature Range: -40°F ~ 392°F (-40°C ~ 200°C) |
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| 100100F00000G | Boyd Laconia, LLC |
Description: THERMAL PASTE Packaging: Bulk Color: White Size / Dimension: 1.25 oz Syringe Type: Silicone Compound Thermal Conductivity: 0.73W/m-K Shelf Life: 24 Months Usable Temperature Range: -40°F ~ 392°F (-40°C ~ 200°C) |
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| 100500F00000G | Boyd Laconia, LLC |
Description: THERMAL PASTE Packaging: Bulk Color: White Size / Dimension: 5 oz Tube Type: Silicone Compound Thermal Conductivity: 0.73W/m-K Shelf Life: 24 Months Usable Temperature Range: -40°F ~ 392°F (-40°C ~ 200°C) |
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| 100800F00000G | Boyd Laconia, LLC |
Description: THERMAL PASTE Packaging: Bulk Color: White Size / Dimension: 8 oz Can Type: Silicone Compound Thermal Conductivity: 0.73W/m-K Shelf Life: 24 Months Usable Temperature Range: -40°F ~ 392°F (-40°C ~ 200°C) |
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| 101600F00000G | Boyd Laconia, LLC |
Description: THERMAL PASTE Packaging: Bulk Color: White Size / Dimension: 16 oz Jar Type: Silicone Compound Thermal Conductivity: 0.73W/m-K Shelf Life: 24 Months Usable Temperature Range: -40°F ~ 392°F (-40°C ~ 200°C) |
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| 103900F00000G | Boyd Laconia, LLC |
 Description: 12 OZ. SEMCO CARTRIDGE GREASE NOPackaging: Dispenser Color: White Size / Dimension: 12 oz Cartridge Type: Non-Silicone Grease Thermal Conductivity: 1.40W/m-K Part Status: Active Shelf Life: 24 Months Usable Temperature Range: -40°F ~ 356°F (-40°C ~ 180°C) |
товар відсутній |
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| 10-6326-28G | Boyd Laconia, LLC |
Description: 10-6326-28G Packaging: Bulk Material: Aluminum Length: 1.102" (28.00mm) Shape: Square, Fins Type: Top Mount Width: 1.102" (28.00mm) Package Cooled: BGA Attachment Method: Push Pin, Thermal Material Thermal Resistance @ Forced Air Flow: 13.13°C/W @ 200 LFM Thermal Resistance @ Natural: 44.10°C/W Fin Height: 0.236" (6.00mm) Material Finish: Black Anodized |
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| 10-6327-01,MOD EARS | Boyd Laconia, LLC |
Description: 10-6327-01 MOD EARS,REV 00,00,04 Packaging: Bulk Material: Aluminum Length: 1.122" (28.50mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.122" (28.50mm) Package Cooled: BGA Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 9.26°C/W @ 200 LFM Thermal Resistance @ Natural: 30.60°C/W Fin Height: 0.394" (10.00mm) Material Finish: Black Anodized |
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115000F00000G | Boyd Laconia, LLC |
Description: STANDARD CLIP CODE 50 Packaging: Bulk For Use With/Related Products: Heat Sinks Accessory Type: Clip |
на замовлення 17583 шт: термін постачання 21-31 дні (днів) |
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116200F00000G | Boyd Laconia, LLC |
Description: STANDARD CLIP CODE 62 Packaging: Bulk For Use With/Related Products: Heat Sinks Accessory Type: Clip |
на замовлення 11400 шт: термін постачання 21-31 дні (днів) |
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118300F00000G | Boyd Laconia, LLC |
Description: STANDARD CLIP CODE 83 Packaging: Bulk For Use With/Related Products: Heat Sinks Accessory Type: Clip |
на замовлення 12429 шт: термін постачання 21-31 дні (днів) |
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125700D00000G | Boyd Laconia, LLC |
Description: SOLDER ANCHOR FOR BGA HEATSINKS Packaging: Bulk For Use With/Related Products: BGA Heat Sinks Accessory Type: Solder Anchor (2 required) Part Status: Active |
на замовлення 64418 шт: термін постачання 21-31 дні (днів) |
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125800D00000G | Boyd Laconia, LLC |
Description: SOLDER ANCHOR FOR BGA HEATSINKS Packaging: Bulk For Use With/Related Products: Heat Sinks Accessory Type: Solder Anchor (2 required) Part Status: Active |
на замовлення 48623 шт: термін постачання 21-31 дні (днів) |
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| 188635F00000G | Boyd Laconia, LLC |
Description: THERM PAD HEATSINK GRAY Packaging: Bulk Color: Gray Material: Silicone Type: Pad, Sheet Usage: TO-218, TO-220, TO-247 |
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| 188651F00000G | Boyd Laconia, LLC |
Description: THERM PAD 17.45MMX14.27MM GRAY Packaging: Bulk Color: Gray Material: Silicone Shape: Rectangular Thickness: 0.0060" (0.152mm) Type: Pad, Sheet Thermal Resistivity: 1.40°C/W, 0.93°C/W Usage: TO-218, TO-220, TO-247 Outline: 17.45mm x 14.27mm Part Status: Active |
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| 189660F00000G | Boyd Laconia, LLC |
Description: 189660F00000G Packaging: Bulk |
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| 189751F00000G | Boyd Laconia, LLC |
Description: PAD,97,0.562X00.687,W/.125HOLE Packaging: Bulk |
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| 189758F00000G | Boyd Laconia, LLC |
Description: PAD,97,0.500X00.750,W/.125HOLE Packaging: Bulk |
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| 189890F00000G | Boyd Laconia, LLC |
Description: PAD,98,0.740X00.860,W/.160HOLG Packaging: Bulk |
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| 2000346-001 REV A | Boyd Laconia, LLC |
Description: 2000346-001 REV A Packaging: Bulk |
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| 2292B | Boyd Laconia, LLC |
Description: THM,17368B REV C-G Packaging: Bulk |
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| 2341BG | Boyd Laconia, LLC |
Description: 2341BG Packaging: Bulk |
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| 2342BG | Boyd Laconia, LLC |
Description: THM,18917B REV H Packaging: Bulk |
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| 241402B92203G | Boyd Laconia, LLC |
Description: H/S ASS'Y(RD002356)241402B92203G Packaging: Bulk Length: 2.283" (58.00mm) Shape: Rectangular, Fins Type: Top Mount Width: 1.457" (37.00mm) Package Cooled: Quarter Brick DC/DC Converter Attachment Method: Bolt On Thermal Resistance @ Forced Air Flow: 1.80°C/W @ 600 LFM Thermal Resistance @ Natural: 3.90°C/W Fin Height: 0.236" (6.00mm) |
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| 241804B92200G | Boyd Laconia, LLC |
Description: 241804B92200G Packaging: Bulk Length: 2.280" (57.90mm) Shape: Rectangular, Fins Type: Top Mount Width: 0.902" (22.90mm) Package Cooled: Eighth Brick DC/DC Converter Attachment Method: Bolt On Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 600 LFM Thermal Resistance @ Natural: 3.60°C/W Fin Height: 0.449" (11.40mm) |
товар відсутній |
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321527B00000G | Boyd Laconia, LLC |
Description: HEATSINK TO-5 2W BLK Packaging: Bag Material: Aluminum Diameter: 0.750" (19.05mm) OD Shape: Cylindrical Type: Top Mount Package Cooled: TO-5, TO-39 Attachment Method: Threaded Coupling Power Dissipation @ Temperature Rise: 0.5W @ 20°C Thermal Resistance @ Forced Air Flow: 20.00°C/W @ 300 LFM Thermal Resistance @ Natural: 35.20°C/W Fin Height: 0.290" (7.37mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 401 шт: термін постачання 21-31 дні (днів) |
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322400B00000G | Boyd Laconia, LLC |
Description: HEAT SINK TO-18 1W BLK Packaging: Bag Material: Aluminum Diameter: 0.180" (4.57mm) ID, 0.500" (12.70mm) OD Shape: Cylindrical Type: Top Mount Package Cooled: TO-18 Attachment Method: Press Fit Power Dissipation @ Temperature Rise: 0.6W @ 60°C Thermal Resistance @ Forced Air Flow: 30.00°C/W @ 500 LFM Thermal Resistance @ Natural: 100.00°C/W Fin Height: 0.235" (5.97mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 810 шт: термін постачання 21-31 дні (днів) |
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322605B00000G | Boyd Laconia, LLC |
Description: HEATSINK TO-5 1.25W H=.25" BLK Packaging: Bag Material: Aluminum Diameter: 0.315" (8.00mm) ID, 0.750" (19.05mm) OD Shape: Cylindrical Type: Top Mount Package Cooled: TO-5 Attachment Method: Press Fit Power Dissipation @ Temperature Rise: 1.0W @ 60°C Thermal Resistance @ Forced Air Flow: 25.00°C/W @ 200 LFM Thermal Resistance @ Natural: 54.00°C/W Fin Height: 0.250" (6.35mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 2199 шт: термін постачання 21-31 дні (днів) |
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325705B00000G | Boyd Laconia, LLC |
Description: TO-5 PUSH-ON HEATSINK 6.35MM Packaging: Bulk Material: Aluminum Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD Shape: Cylindrical Type: Board Level Package Cooled: TO-5 Attachment Method: Press Fit Power Dissipation @ Temperature Rise: 1.0W @ 60°C Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM Thermal Resistance @ Natural: 60.00°C/W Fin Height: 0.250" (6.35mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 923 шт: термін постачання 21-31 дні (днів) |
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| 325705R00000G | Boyd Laconia, LLC |
Description: BOARD LEVEL HEAT SINK Packaging: Bulk Material: Aluminum Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD Shape: Cylindrical Type: Board Level Package Cooled: TO-5 Attachment Method: Press Fit Power Dissipation @ Temperature Rise: 1.0W @ 60°C Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM Thermal Resistance @ Natural: 60.00°C/W Fin Height: 0.250" (6.35mm) Material Finish: Red Anodized |
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| 335824B00032G | Boyd Laconia, LLC |
Description: PGA,335824B00032G Packaging: Bulk Material: Aluminum Length: 1.180" (29.97mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.180" (29.97mm) Package Cooled: BGA, FPGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 1.5W @ 50°C Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 200 LFM Thermal Resistance @ Natural: 29.40°C/W Fin Height: 0.370" (9.40mm) Material Finish: Black Anodized |
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335824B00034G | Boyd Laconia, LLC |
 Description: HEATSINK BGA W/ADHESIVE TAPEPackaging: Bulk Material: Aluminum Length: 1.180" (29.97mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.180" (29.97mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 2.0W @ 60°C Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 200 LFM Thermal Resistance @ Natural: 29.40°C/W Fin Height: 0.370" (9.40mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 1267 шт: термін постачання 21-31 дні (днів) |
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342941 | Boyd Laconia, LLC |
Description: COPPER HEATSINK 40X40.5X13.5MM Packaging: Tray Material: Copper Length: 1.594" (40.50mm) Shape: Square, Fins Type: Top Mount, Skived Width: 1.575" (40.00mm) Package Cooled: BGA Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM Thermal Resistance @ Natural: 13.30°C/W Fin Height: 0.531" (13.50mm) Material Finish: AavSHIELD 3C |
на замовлення 226 шт: термін постачання 21-31 дні (днів) |
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342948 | Boyd Laconia, LLC |
Description: COPPER HEATSINK 70X69X14MM Packaging: Tray Material: Copper Length: 2.717" (69.00mm) Shape: Square, Fins Type: Top Mount, Skived Width: 2.756" (70.00mm) Package Cooled: BGA Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 1.40°C/W @ 200 LFM Thermal Resistance @ Natural: 5.60°C/W Fin Height: 0.551" (14.00mm) Material Finish: AavSHIELD 3C Part Status: Active |
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| 342948-copper skivfin | Boyd Laconia, LLC |
Description: 342948,REV03(GP) Packaging: Bulk Material: Copper Length: 2.717" (69.00mm) Shape: Rectangular, Fins Type: Board Level Width: 2.756" (70.00mm) Package Cooled: BGA, FPGA Attachment Method: Push Pin, Thermal Material Fin Height: 0.551" (14.00mm) |
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342949 | Boyd Laconia, LLC |
Description: COPPER HEATSINK 80X80X12MM Packaging: Tray Material: Copper Length: 3.150" (80.00mm) Shape: Square, Fins Type: Top Mount, Skived Width: 3.150" (80.00mm) Package Cooled: BGA Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 1.20°C/W @ 200 LFM Thermal Resistance @ Natural: 5.10°C/W Fin Height: 0.472" (12.00mm) Material Finish: AavSHIELD 3C Part Status: Active |
на замовлення 177 шт: термін постачання 21-31 дні (днів) |
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342950 | Boyd Laconia, LLC |
Description: COPPER HEATSINK 90X90X10MM Packaging: Tray Material: Copper Length: 3.543" (90.00mm) Shape: Square, Fins Type: Top Mount, Skived Width: 3.543" (90.00mm) Package Cooled: BGA Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 1.30°C/W @ 200 LFM Thermal Resistance @ Natural: 4.50°C/W Fin Height: 0.394" (10.00mm) Material Finish: AavSHIELD 3C |
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371824B00032G | Boyd Laconia, LLC |
 Description: HEATSINK BGA W/ADHESIVE TAPEPackaging: Tray Material: Aluminum Length: 1.378" (35.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.378" (35.00mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 1.5W @ 50°C Thermal Resistance @ Forced Air Flow: 9.70°C/W @ 200 LFM Thermal Resistance @ Natural: 31.90°C/W Fin Height: 0.275" (7.00mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 447 шт: термін постачання 21-31 дні (днів) |
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| 371924B00032G | Boyd Laconia, LLC |
Description: 371924B00032G Packaging: Bulk Material: Aluminum Length: 1.378" (35.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.378" (35.00mm) Package Cooled: BGA, FPGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 3.0W @ 60°C Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM Thermal Resistance @ Natural: 31.90°C/W Fin Height: 0.551" (14.00mm) Material Finish: Black Anodized |
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| 372924M02000G( 10-5597-02G ) | Boyd Laconia, LLC |
Description: 372924M02000G( 10-5597-02G ) Packaging: Bulk |
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374024B00035G | Boyd Laconia, LLC |
Description: HEATSINK BGA 23X23X10MM W/ADH Packaging: Bulk Material: Aluminum Length: 0.906" (23.01mm) Shape: Square, Pin Fins Type: Top Mount Width: 0.906" (23.01mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 1.0W @ 40°C Thermal Resistance @ Forced Air Flow: 11.70°C/W @ 200 LFM Thermal Resistance @ Natural: 40.00°C/W Fin Height: 0.394" (10.00mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 1194 шт: термін постачання 21-31 дні (днів) |
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| 374024B60024G-MOD W/STAB PAD | Boyd Laconia, LLC |
Description: 374024B60024G-MOD W/STAB PAD Packaging: Bulk |
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374324B60023G | Boyd Laconia, LLC |
Description: BGA HEAT SINK Packaging: Bulk Material: Aluminum Length: 1.063" (27.00mm) Shape: Square, Pin Fins Type: Board Level Width: 1.063" (27.00mm) Package Cooled: BGA, FPGA Attachment Method: Solder Anchor Power Dissipation @ Temperature Rise: 1.5W @ 50°C Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 500 LFM Thermal Resistance @ Natural: 30.60°C/W Fin Height: 0.394" (10.00mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 3464 шт: термін постачання 21-31 дні (днів) |
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374424B00035G | Boyd Laconia, LLC |
Description: HEATSINK BGA W/ADHESIVE TAPE Packaging: Bulk Material: Aluminum Length: 1.063" (27.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.063" (27.00mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 4.0W @ 80°C Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM Thermal Resistance @ Natural: 20.30°C/W Fin Height: 0.709" (18.00mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 2315 шт: термін постачання 21-31 дні (днів) |
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| 374524B00000G | Boyd Laconia, LLC |
Description: 374524B00000G Packaging: Bulk |
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| 374624B00000G W/3M8810 | Boyd Laconia, LLC |
Description: 374624B00000G W/3M8810 Packaging: Bulk |
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374624B00032G | Boyd Laconia, LLC |
Description: HEATSINK BGA 35X35X10MM W/ADH Packaging: Bulk Material: Aluminum Length: 1.378" (35.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.378" (35.00mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 1.5W @ 40°C Thermal Resistance @ Forced Air Flow: 7.60°C/W @ 200 LFM Thermal Resistance @ Natural: 23.40°C/W Fin Height: 0.394" (10.00mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 485 шт: термін постачання 21-31 дні (днів) |
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374724B00032G | Boyd Laconia, LLC |
Description: HEATSINK BGA W/ADHESIVE TAPE Packaging: Bulk Material: Aluminum Length: 1.378" (35.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.378" (35.00mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 3.0W @ 50°C Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM Thermal Resistance @ Natural: 15.30°C/W Fin Height: 0.709" (18.00mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 1602 шт: термін постачання 21-31 дні (днів) |
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374724B00035G | Boyd Laconia, LLC |
Description: HEATSINK BGA 35X35X18MM W/ADH Packaging: Bulk Material: Aluminum Length: 1.378" (35.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.378" (35.00mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 3.0W @ 50°C Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM Thermal Resistance @ Natural: 15.30°C/W Fin Height: 0.709" (18.00mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 915 шт: термін постачання 21-31 дні (днів) |
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374724B60024G | Boyd Laconia, LLC |
Description: HEATSINK BGA W/O SOLDER ANCHORS Packaging: Bulk Material: Aluminum Length: 1.378" (35.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.378" (35.00mm) Package Cooled: BGA Attachment Method: Solder Anchor Power Dissipation @ Temperature Rise: 3.0W @ 50°C Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM Thermal Resistance @ Natural: 15.30°C/W Fin Height: 0.709" (18.00mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 854 шт: термін постачання 21-31 дні (днів) |
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| 374824B00000G | Boyd Laconia, LLC |
Description: 374824B00000G Packaging: Bulk |
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| 374824B00032G | Boyd Laconia, LLC |
Description: 374824B00032G Packaging: Bulk Material: Aluminum Length: 1.378" (35.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.378" (35.00mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 2.0W @ 30°C Thermal Resistance @ Forced Air Flow: 4.30°C/W @ 200 LFM Thermal Resistance @ Natural: 12.00°C/W Fin Height: 0.984" (25.00mm) Material Finish: Black Anodized |
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374924B00032G | Boyd Laconia, LLC |
 Description: HEATSINK BGA W/ADHESIVE TAPEPackaging: Bulk Material: Aluminum Length: 1.575" (40.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.575" (40.01mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 4.0W @ 80°C Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM Thermal Resistance @ Natural: 20.30°C/W Fin Height: 0.394" (10.00mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 639 шт: термін постачання 21-31 дні (днів) |
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375024B00032G | Boyd Laconia, LLC |
Description: HEATSINK BGA W/ADHESIVE TAPE Packaging: Bulk Material: Aluminum Length: 1.575" (40.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.575" (40.01mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 2.0W @ 30°C Thermal Resistance @ Forced Air Flow: 4.30°C/W @ 200 LFM Thermal Resistance @ Natural: 12.00°C/W Fin Height: 0.709" (18.00mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 1360 шт: термін постачання 21-31 дні (днів) |
|
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| 3751320-PAH14010-P0 | Boyd Laconia, LLC |
Description: 3751320-PAH14010-P0 Packaging: Bulk Material: Aluminum Alloy Length: 1.575" (40.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.575" (40.00mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Fin Height: 0.984" (25.00mm) Material Finish: Black Anodized |
товар відсутній |
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 |
375424B00034G | Boyd Laconia, LLC |
Description: HEATSINK PIN-FIN W/TAPE Packaging: Bulk Material: Aluminum Length: 0.598" (15.19mm) Shape: Square, Pin Fins Type: Top Mount Width: 0.598" (15.19mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Thermal Resistance @ Forced Air Flow: 17.60°C/W @ 200 LFM Thermal Resistance @ Natural: 62.50°C/W Fin Height: 0.252" (6.40mm) Material Finish: Black Anodized Part Status: Active |
на замовлення 1421 шт: термін постачання 21-31 дні (днів) |
|
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 |
416101U00000G | Boyd Laconia, LLC |
Description: COLD PLATE HEAT SINK 0.010C/W Packaging: Box Dimensions - Overall: 9.19" L x 7.00" W x 0.64" H (233.4mm x 177.8mm x 16.3mm) Product Type: Passive, Cold Plate Thermal Resistance @ GPM: 0.010°C/W @ 1.5 GPM |
на замовлення 114 шт: термін постачання 21-31 дні (днів) |
|
| 0015-35035A |
товар відсутній
| 0SY76-127-B |
товар відсутній
| 100000F00000G |
Виробник: Boyd Laconia, LLC
Description: THERMAL PASTE
Packaging: Bulk
Color: White
Size / Dimension: 1 gram Ampule
Type: Silicone Compound
Thermal Conductivity: 0.73W/m-K
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 392°F (-40°C ~ 200°C)
Description: THERMAL PASTE
Packaging: Bulk
Color: White
Size / Dimension: 1 gram Ampule
Type: Silicone Compound
Thermal Conductivity: 0.73W/m-K
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 392°F (-40°C ~ 200°C)
товар відсутній
| 100100F00000G |
Виробник: Boyd Laconia, LLC
Description: THERMAL PASTE
Packaging: Bulk
Color: White
Size / Dimension: 1.25 oz Syringe
Type: Silicone Compound
Thermal Conductivity: 0.73W/m-K
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 392°F (-40°C ~ 200°C)
Description: THERMAL PASTE
Packaging: Bulk
Color: White
Size / Dimension: 1.25 oz Syringe
Type: Silicone Compound
Thermal Conductivity: 0.73W/m-K
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 392°F (-40°C ~ 200°C)
товар відсутній
| 100500F00000G |
Виробник: Boyd Laconia, LLC
Description: THERMAL PASTE
Packaging: Bulk
Color: White
Size / Dimension: 5 oz Tube
Type: Silicone Compound
Thermal Conductivity: 0.73W/m-K
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 392°F (-40°C ~ 200°C)
Description: THERMAL PASTE
Packaging: Bulk
Color: White
Size / Dimension: 5 oz Tube
Type: Silicone Compound
Thermal Conductivity: 0.73W/m-K
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 392°F (-40°C ~ 200°C)
товар відсутній
| 100800F00000G |
Виробник: Boyd Laconia, LLC
Description: THERMAL PASTE
Packaging: Bulk
Color: White
Size / Dimension: 8 oz Can
Type: Silicone Compound
Thermal Conductivity: 0.73W/m-K
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 392°F (-40°C ~ 200°C)
Description: THERMAL PASTE
Packaging: Bulk
Color: White
Size / Dimension: 8 oz Can
Type: Silicone Compound
Thermal Conductivity: 0.73W/m-K
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 392°F (-40°C ~ 200°C)
товар відсутній
| 101600F00000G |
Виробник: Boyd Laconia, LLC
Description: THERMAL PASTE
Packaging: Bulk
Color: White
Size / Dimension: 16 oz Jar
Type: Silicone Compound
Thermal Conductivity: 0.73W/m-K
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 392°F (-40°C ~ 200°C)
Description: THERMAL PASTE
Packaging: Bulk
Color: White
Size / Dimension: 16 oz Jar
Type: Silicone Compound
Thermal Conductivity: 0.73W/m-K
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 392°F (-40°C ~ 200°C)
товар відсутній
| 103900F00000G |
|
Виробник: Boyd Laconia, LLC
Description: 12 OZ. SEMCO CARTRIDGE GREASE NO
Packaging: Dispenser
Color: White
Size / Dimension: 12 oz Cartridge
Type: Non-Silicone Grease
Thermal Conductivity: 1.40W/m-K
Part Status: Active
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 356°F (-40°C ~ 180°C)
Description: 12 OZ. SEMCO CARTRIDGE GREASE NO
Packaging: Dispenser
Color: White
Size / Dimension: 12 oz Cartridge
Type: Non-Silicone Grease
Thermal Conductivity: 1.40W/m-K
Part Status: Active
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 356°F (-40°C ~ 180°C)
товар відсутній
| 10-6326-28G |
Виробник: Boyd Laconia, LLC
Description: 10-6326-28G
Packaging: Bulk
Material: Aluminum
Length: 1.102" (28.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.102" (28.00mm)
Package Cooled: BGA
Attachment Method: Push Pin, Thermal Material
Thermal Resistance @ Forced Air Flow: 13.13°C/W @ 200 LFM
Thermal Resistance @ Natural: 44.10°C/W
Fin Height: 0.236" (6.00mm)
Material Finish: Black Anodized
Description: 10-6326-28G
Packaging: Bulk
Material: Aluminum
Length: 1.102" (28.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.102" (28.00mm)
Package Cooled: BGA
Attachment Method: Push Pin, Thermal Material
Thermal Resistance @ Forced Air Flow: 13.13°C/W @ 200 LFM
Thermal Resistance @ Natural: 44.10°C/W
Fin Height: 0.236" (6.00mm)
Material Finish: Black Anodized
товар відсутній
| 10-6327-01,MOD EARS |
Виробник: Boyd Laconia, LLC
Description: 10-6327-01 MOD EARS,REV 00,00,04
Packaging: Bulk
Material: Aluminum
Length: 1.122" (28.50mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.122" (28.50mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 9.26°C/W @ 200 LFM
Thermal Resistance @ Natural: 30.60°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Description: 10-6327-01 MOD EARS,REV 00,00,04
Packaging: Bulk
Material: Aluminum
Length: 1.122" (28.50mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.122" (28.50mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 9.26°C/W @ 200 LFM
Thermal Resistance @ Natural: 30.60°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
товар відсутній
| 115000F00000G |
Виробник: Boyd Laconia, LLC
Description: STANDARD CLIP CODE 50
Packaging: Bulk
For Use With/Related Products: Heat Sinks
Accessory Type: Clip
Description: STANDARD CLIP CODE 50
Packaging: Bulk
For Use With/Related Products: Heat Sinks
Accessory Type: Clip
на замовлення 17583 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 10+ | 28.65 грн |
| 25+ | 27.18 грн |
| 50+ | 24.84 грн |
| 100+ | 24.51 грн |
| 250+ | 22.83 грн |
| 500+ | 21.14 грн |
| 2500+ | 19.15 грн |
| 5000+ | 18.49 грн |
| 116200F00000G |
Виробник: Boyd Laconia, LLC
Description: STANDARD CLIP CODE 62
Packaging: Bulk
For Use With/Related Products: Heat Sinks
Accessory Type: Clip
Description: STANDARD CLIP CODE 62
Packaging: Bulk
For Use With/Related Products: Heat Sinks
Accessory Type: Clip
на замовлення 11400 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 10+ | 28.74 грн |
| 11+ | 26.29 грн |
| 100+ | 24.02 грн |
| 1000+ | 17.91 грн |
| 5000+ | 17.3 грн |
| 10000+ | 16.06 грн |
| 118300F00000G |
|
Виробник: Boyd Laconia, LLC
Description: STANDARD CLIP CODE 83
Packaging: Bulk
For Use With/Related Products: Heat Sinks
Accessory Type: Clip
Description: STANDARD CLIP CODE 83
Packaging: Bulk
For Use With/Related Products: Heat Sinks
Accessory Type: Clip
на замовлення 12429 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 8+ | 36.65 грн |
| 10+ | 33.56 грн |
| 25+ | 31.91 грн |
| 50+ | 29.16 грн |
| 100+ | 28.77 грн |
| 250+ | 26.79 грн |
| 500+ | 24.8 грн |
| 2500+ | 22.48 грн |
| 5000+ | 21.7 грн |
| 125700D00000G |
|
Виробник: Boyd Laconia, LLC
Description: SOLDER ANCHOR FOR BGA HEATSINKS
Packaging: Bulk
For Use With/Related Products: BGA Heat Sinks
Accessory Type: Solder Anchor (2 required)
Part Status: Active
Description: SOLDER ANCHOR FOR BGA HEATSINKS
Packaging: Bulk
For Use With/Related Products: BGA Heat Sinks
Accessory Type: Solder Anchor (2 required)
Part Status: Active
на замовлення 64418 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 7+ | 42.39 грн |
| 10+ | 39.09 грн |
| 25+ | 37.12 грн |
| 50+ | 33.91 грн |
| 100+ | 33.45 грн |
| 250+ | 31.16 грн |
| 500+ | 28.85 грн |
| 1000+ | 26.14 грн |
| 5000+ | 25.24 грн |
| 125800D00000G |
Виробник: Boyd Laconia, LLC
Description: SOLDER ANCHOR FOR BGA HEATSINKS
Packaging: Bulk
For Use With/Related Products: Heat Sinks
Accessory Type: Solder Anchor (2 required)
Part Status: Active
Description: SOLDER ANCHOR FOR BGA HEATSINKS
Packaging: Bulk
For Use With/Related Products: Heat Sinks
Accessory Type: Solder Anchor (2 required)
Part Status: Active
на замовлення 48623 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 17+ | 17.25 грн |
| 18+ | 15.78 грн |
| 100+ | 14.36 грн |
| 1000+ | 10.71 грн |
| 5000+ | 10.34 грн |
| 10000+ | 9.6 грн |
| 188635F00000G |
Виробник: Boyd Laconia, LLC
Description: THERM PAD HEATSINK GRAY
Packaging: Bulk
Color: Gray
Material: Silicone
Type: Pad, Sheet
Usage: TO-218, TO-220, TO-247
Description: THERM PAD HEATSINK GRAY
Packaging: Bulk
Color: Gray
Material: Silicone
Type: Pad, Sheet
Usage: TO-218, TO-220, TO-247
товар відсутній
| 188651F00000G |
Виробник: Boyd Laconia, LLC
Description: THERM PAD 17.45MMX14.27MM GRAY
Packaging: Bulk
Color: Gray
Material: Silicone
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Thermal Resistivity: 1.40°C/W, 0.93°C/W
Usage: TO-218, TO-220, TO-247
Outline: 17.45mm x 14.27mm
Part Status: Active
Description: THERM PAD 17.45MMX14.27MM GRAY
Packaging: Bulk
Color: Gray
Material: Silicone
Shape: Rectangular
Thickness: 0.0060" (0.152mm)
Type: Pad, Sheet
Thermal Resistivity: 1.40°C/W, 0.93°C/W
Usage: TO-218, TO-220, TO-247
Outline: 17.45mm x 14.27mm
Part Status: Active
товар відсутній
| 189751F00000G |
товар відсутній
| 189758F00000G |
товар відсутній
| 189890F00000G |
товар відсутній
| 2000346-001 REV A |
товар відсутній
| 241402B92203G |
Виробник: Boyd Laconia, LLC
Description: H/S ASS'Y(RD002356)241402B92203G
Packaging: Bulk
Length: 2.283" (58.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.457" (37.00mm)
Package Cooled: Quarter Brick DC/DC Converter
Attachment Method: Bolt On
Thermal Resistance @ Forced Air Flow: 1.80°C/W @ 600 LFM
Thermal Resistance @ Natural: 3.90°C/W
Fin Height: 0.236" (6.00mm)
Description: H/S ASS'Y(RD002356)241402B92203G
Packaging: Bulk
Length: 2.283" (58.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.457" (37.00mm)
Package Cooled: Quarter Brick DC/DC Converter
Attachment Method: Bolt On
Thermal Resistance @ Forced Air Flow: 1.80°C/W @ 600 LFM
Thermal Resistance @ Natural: 3.90°C/W
Fin Height: 0.236" (6.00mm)
товар відсутній
| 241804B92200G |
Виробник: Boyd Laconia, LLC
Description: 241804B92200G
Packaging: Bulk
Length: 2.280" (57.90mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 0.902" (22.90mm)
Package Cooled: Eighth Brick DC/DC Converter
Attachment Method: Bolt On
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 3.60°C/W
Fin Height: 0.449" (11.40mm)
Description: 241804B92200G
Packaging: Bulk
Length: 2.280" (57.90mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 0.902" (22.90mm)
Package Cooled: Eighth Brick DC/DC Converter
Attachment Method: Bolt On
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 600 LFM
Thermal Resistance @ Natural: 3.60°C/W
Fin Height: 0.449" (11.40mm)
товар відсутній
| 321527B00000G |
|
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-5 2W BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.750" (19.05mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-5, TO-39
Attachment Method: Threaded Coupling
Power Dissipation @ Temperature Rise: 0.5W @ 20°C
Thermal Resistance @ Forced Air Flow: 20.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 35.20°C/W
Fin Height: 0.290" (7.37mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-5 2W BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.750" (19.05mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-5, TO-39
Attachment Method: Threaded Coupling
Power Dissipation @ Temperature Rise: 0.5W @ 20°C
Thermal Resistance @ Forced Air Flow: 20.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 35.20°C/W
Fin Height: 0.290" (7.37mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 401 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1350.87 грн |
| 10+ | 1228.95 грн |
| 25+ | 1156.61 грн |
| 50+ | 1017.59 грн |
| 100+ | 949.75 грн |
| 250+ | 881.91 грн |
| 322400B00000G |
|
Виробник: Boyd Laconia, LLC
Description: HEAT SINK TO-18 1W BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.180" (4.57mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-18
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 0.6W @ 60°C
Thermal Resistance @ Forced Air Flow: 30.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 100.00°C/W
Fin Height: 0.235" (5.97mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEAT SINK TO-18 1W BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.180" (4.57mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-18
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 0.6W @ 60°C
Thermal Resistance @ Forced Air Flow: 30.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 100.00°C/W
Fin Height: 0.235" (5.97mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 810 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 150.9 грн |
| 10+ | 141.29 грн |
| 25+ | 137.5 грн |
| 50+ | 121.87 грн |
| 100+ | 114.69 грн |
| 250+ | 107.53 грн |
| 500+ | 102.24 грн |
| 322605B00000G |
|
Виробник: Boyd Laconia, LLC
Description: HEATSINK TO-5 1.25W H=.25" BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.315" (8.00mm) ID, 0.750" (19.05mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 25.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 54.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK TO-5 1.25W H=.25" BLK
Packaging: Bag
Material: Aluminum
Diameter: 0.315" (8.00mm) ID, 0.750" (19.05mm) OD
Shape: Cylindrical
Type: Top Mount
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 25.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 54.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 2199 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 201.19 грн |
| 10+ | 188.62 грн |
| 25+ | 183.53 грн |
| 50+ | 162.66 грн |
| 100+ | 153.1 грн |
| 250+ | 143.53 грн |
| 500+ | 136.47 грн |
| 1000+ | 122.35 грн |
| 325705B00000G |
|
Виробник: Boyd Laconia, LLC
Description: TO-5 PUSH-ON HEATSINK 6.35MM
Packaging: Bulk
Material: Aluminum
Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 60.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
Part Status: Active
Description: TO-5 PUSH-ON HEATSINK 6.35MM
Packaging: Bulk
Material: Aluminum
Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 60.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 923 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 97 грн |
| 10+ | 88.36 грн |
| 100+ | 79.09 грн |
| 325705R00000G |
|
Виробник: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 60.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Red Anodized
Description: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Diameter: 0.318" (8.07mm) ID, 0.500" (12.70mm) OD
Shape: Cylindrical
Type: Board Level
Package Cooled: TO-5
Attachment Method: Press Fit
Power Dissipation @ Temperature Rise: 1.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 35.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 60.00°C/W
Fin Height: 0.250" (6.35mm)
Material Finish: Red Anodized
товар відсутній
| 335824B00032G |
Виробник: Boyd Laconia, LLC
Description: PGA,335824B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.180" (29.97mm)
Package Cooled: BGA, FPGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 50°C
Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 200 LFM
Thermal Resistance @ Natural: 29.40°C/W
Fin Height: 0.370" (9.40mm)
Material Finish: Black Anodized
Description: PGA,335824B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.180" (29.97mm)
Package Cooled: BGA, FPGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 50°C
Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 200 LFM
Thermal Resistance @ Natural: 29.40°C/W
Fin Height: 0.370" (9.40mm)
Material Finish: Black Anodized
товар відсутній
| 335824B00034G |
|
Виробник: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.180" (29.97mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 200 LFM
Thermal Resistance @ Natural: 29.40°C/W
Fin Height: 0.370" (9.40mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.180" (29.97mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.180" (29.97mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 200 LFM
Thermal Resistance @ Natural: 29.40°C/W
Fin Height: 0.370" (9.40mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 1267 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 596.4 грн |
| 10+ | 558.95 грн |
| 672+ | 403.7 грн |
| 342941 |
|
Виробник: Boyd Laconia, LLC
Description: COPPER HEATSINK 40X40.5X13.5MM
Packaging: Tray
Material: Copper
Length: 1.594" (40.50mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 1.575" (40.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 13.30°C/W
Fin Height: 0.531" (13.50mm)
Material Finish: AavSHIELD 3C
Description: COPPER HEATSINK 40X40.5X13.5MM
Packaging: Tray
Material: Copper
Length: 1.594" (40.50mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 1.575" (40.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 13.30°C/W
Fin Height: 0.531" (13.50mm)
Material Finish: AavSHIELD 3C
на замовлення 226 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2338.16 грн |
| 10+ | 2119.05 грн |
| 25+ | 1986.69 грн |
| 40+ | 1740.11 грн |
| 80+ | 1677.97 грн |
| 342948 |
|
Виробник: Boyd Laconia, LLC
Description: COPPER HEATSINK 70X69X14MM
Packaging: Tray
Material: Copper
Length: 2.717" (69.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 2.756" (70.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.40°C/W @ 200 LFM
Thermal Resistance @ Natural: 5.60°C/W
Fin Height: 0.551" (14.00mm)
Material Finish: AavSHIELD 3C
Part Status: Active
Description: COPPER HEATSINK 70X69X14MM
Packaging: Tray
Material: Copper
Length: 2.717" (69.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 2.756" (70.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.40°C/W @ 200 LFM
Thermal Resistance @ Natural: 5.60°C/W
Fin Height: 0.551" (14.00mm)
Material Finish: AavSHIELD 3C
Part Status: Active
товар відсутній
| 342948-copper skivfin |
Виробник: Boyd Laconia, LLC
Description: 342948,REV03(GP)
Packaging: Bulk
Material: Copper
Length: 2.717" (69.00mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 2.756" (70.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Push Pin, Thermal Material
Fin Height: 0.551" (14.00mm)
Description: 342948,REV03(GP)
Packaging: Bulk
Material: Copper
Length: 2.717" (69.00mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 2.756" (70.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Push Pin, Thermal Material
Fin Height: 0.551" (14.00mm)
товар відсутній
| 342949 |
|
Виробник: Boyd Laconia, LLC
Description: COPPER HEATSINK 80X80X12MM
Packaging: Tray
Material: Copper
Length: 3.150" (80.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 3.150" (80.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 5.10°C/W
Fin Height: 0.472" (12.00mm)
Material Finish: AavSHIELD 3C
Part Status: Active
Description: COPPER HEATSINK 80X80X12MM
Packaging: Tray
Material: Copper
Length: 3.150" (80.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 3.150" (80.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 5.10°C/W
Fin Height: 0.472" (12.00mm)
Material Finish: AavSHIELD 3C
Part Status: Active
на замовлення 177 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4105.79 грн |
| 10+ | 3721.58 грн |
| 25+ | 3488.96 грн |
| 50+ | 3055.97 грн |
| 100+ | 2946.83 грн |
| 342950 |
|
Виробник: Boyd Laconia, LLC
Description: COPPER HEATSINK 90X90X10MM
Packaging: Tray
Material: Copper
Length: 3.543" (90.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 3.543" (90.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 4.50°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: AavSHIELD 3C
Description: COPPER HEATSINK 90X90X10MM
Packaging: Tray
Material: Copper
Length: 3.543" (90.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 3.543" (90.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 4.50°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: AavSHIELD 3C
товар відсутній
| 371824B00032G |
|
Виробник: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Tray
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 50°C
Thermal Resistance @ Forced Air Flow: 9.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 31.90°C/W
Fin Height: 0.275" (7.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Tray
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 50°C
Thermal Resistance @ Forced Air Flow: 9.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 31.90°C/W
Fin Height: 0.275" (7.00mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 447 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 494.36 грн |
| 10+ | 462.9 грн |
| 25+ | 437.19 грн |
| 40+ | 386.16 грн |
| 80+ | 362.01 грн |
| 230+ | 337.88 грн |
| 371924B00032G |
Виробник: Boyd Laconia, LLC
Description: 371924B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 31.90°C/W
Fin Height: 0.551" (14.00mm)
Material Finish: Black Anodized
Description: 371924B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 31.90°C/W
Fin Height: 0.551" (14.00mm)
Material Finish: Black Anodized
товар відсутній
| 372924M02000G( 10-5597-02G ) |
товар відсутній
| 374024B00035G |
|
Виробник: Boyd Laconia, LLC
Description: HEATSINK BGA 23X23X10MM W/ADH
Packaging: Bulk
Material: Aluminum
Length: 0.906" (23.01mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.906" (23.01mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 11.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 40.00°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK BGA 23X23X10MM W/ADH
Packaging: Bulk
Material: Aluminum
Length: 0.906" (23.01mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.906" (23.01mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 11.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 40.00°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 1194 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 130.06 грн |
| 10+ | 118.46 грн |
| 100+ | 106.02 грн |
| 1078+ | 81.93 грн |
| 374024B60024G-MOD W/STAB PAD |
товар відсутній
| 374324B60023G |
|
Виробник: Boyd Laconia, LLC
Description: BGA HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Board Level
Width: 1.063" (27.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 1.5W @ 50°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 30.60°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: BGA HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Board Level
Width: 1.063" (27.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 1.5W @ 50°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 30.60°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 3464 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 161.67 грн |
| 10+ | 152.09 грн |
| 25+ | 147.94 грн |
| 50+ | 135.79 грн |
| 374424B00035G |
|
Виробник: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.063" (27.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 4.0W @ 80°C
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 20.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.063" (27.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 4.0W @ 80°C
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 20.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 2315 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 222.03 грн |
| 10+ | 208.27 грн |
| 540+ | 163.25 грн |
| 1080+ | 137.35 грн |
| 374624B00000G W/3M8810 |
товар відсутній
| 374624B00032G |
|
Виробник: Boyd Laconia, LLC
Description: HEATSINK BGA 35X35X10MM W/ADH
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 40°C
Thermal Resistance @ Forced Air Flow: 7.60°C/W @ 200 LFM
Thermal Resistance @ Natural: 23.40°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK BGA 35X35X10MM W/ADH
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 40°C
Thermal Resistance @ Forced Air Flow: 7.60°C/W @ 200 LFM
Thermal Resistance @ Natural: 23.40°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 485 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 234.97 грн |
| 10+ | 220.17 грн |
| 374724B00032G |
|
Виробник: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 1602 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 238.56 грн |
| 10+ | 224.19 грн |
| 25+ | 218.07 грн |
| 50+ | 193.27 грн |
| 100+ | 181.92 грн |
| 250+ | 170.54 грн |
| 672+ | 162.16 грн |
| 1344+ | 145.38 грн |
| 374724B00035G |
|
Виробник: Boyd Laconia, LLC
Description: HEATSINK BGA 35X35X18MM W/ADH
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK BGA 35X35X18MM W/ADH
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 915 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 378.68 грн |
| 10+ | 354.96 грн |
| 672+ | 278.21 грн |
| 374724B60024G |
|
Виробник: Boyd Laconia, LLC
Description: HEATSINK BGA W/O SOLDER ANCHORS
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK BGA W/O SOLDER ANCHORS
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 854 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 467.06 грн |
| 10+ | 437.44 грн |
| 168+ | 364.53 грн |
| 374824B00032G |
Виробник: Boyd Laconia, LLC
Description: 374824B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 4.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 12.00°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Description: 374824B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 4.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 12.00°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
товар відсутній
| 374924B00032G |
|
Виробник: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.575" (40.01mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 4.0W @ 80°C
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 20.30°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.575" (40.01mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 4.0W @ 80°C
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 20.30°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 639 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 217.72 грн |
| 10+ | 204.12 грн |
| 390+ | 165.51 грн |
| 375024B00032G |
|
Виробник: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.575" (40.01mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 4.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 12.00°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.575" (40.01mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 4.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 12.00°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 1360 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 214.13 грн |
| 10+ | 200.52 грн |
| 450+ | 157.15 грн |
| 1350+ | 132.22 грн |
| 3751320-PAH14010-P0 |
Виробник: Boyd Laconia, LLC
Description: 3751320-PAH14010-P0
Packaging: Bulk
Material: Aluminum Alloy
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Description: 3751320-PAH14010-P0
Packaging: Bulk
Material: Aluminum Alloy
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
товар відсутній
| 375424B00034G |
|
Виробник: Boyd Laconia, LLC
Description: HEATSINK PIN-FIN W/TAPE
Packaging: Bulk
Material: Aluminum
Length: 0.598" (15.19mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.598" (15.19mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 17.60°C/W @ 200 LFM
Thermal Resistance @ Natural: 62.50°C/W
Fin Height: 0.252" (6.40mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK PIN-FIN W/TAPE
Packaging: Bulk
Material: Aluminum
Length: 0.598" (15.19mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.598" (15.19mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 17.60°C/W @ 200 LFM
Thermal Resistance @ Natural: 62.50°C/W
Fin Height: 0.252" (6.40mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 1421 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 89.1 грн |
| 10+ | 81.58 грн |
| 25+ | 79.41 грн |
| 50+ | 72.49 грн |
| 100+ | 68.47 грн |
| 250+ | 64.44 грн |
| 500+ | 59.42 грн |
| 1000+ | 55.46 грн |
| 416101U00000G |
|
Виробник: Boyd Laconia, LLC
Description: COLD PLATE HEAT SINK 0.010C/W
Packaging: Box
Dimensions - Overall: 9.19" L x 7.00" W x 0.64" H (233.4mm x 177.8mm x 16.3mm)
Product Type: Passive, Cold Plate
Thermal Resistance @ GPM: 0.010°C/W @ 1.5 GPM
Description: COLD PLATE HEAT SINK 0.010C/W
Packaging: Box
Dimensions - Overall: 9.19" L x 7.00" W x 0.64" H (233.4mm x 177.8mm x 16.3mm)
Product Type: Passive, Cold Plate
Thermal Resistance @ GPM: 0.010°C/W @ 1.5 GPM
на замовлення 114 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 6747.17 грн |
| 12+ | 6091.17 грн |
| 28+ | 5685.09 грн |
| 52+ | 5144.7 грн |
| 100+ | 4954.16 грн |