Технічний опис 117-83-430-41-105101 Preci-Dip
Description: CONN IC DIP SOCKET 30POS GOLD, Packaging: Bulk, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.4" (10.16mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 30 (2 x 15), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Pitch - Mating: 0.070" (1.78mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.070" (1.78mm), Contact Finish - Post: Tin, Contact Material - Post: Brass, Part Status: Active.
Інші пропозиції 117-83-430-41-105101
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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117-83-430-41-105101 | Виробник : Preci-Dip |
Description: CONN IC DIP SOCKET 30POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 30 (2 x 15) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товар відсутній |
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117-83-430-41-105101 | Виробник : Preci-dip | Board to Board & Mezzanine Connectors |
товар відсутній |