36-6552-18 Aries Electronics


Виробник: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 36POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 250°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polyetheretherketone (PEEK), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Nickel
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Nickel
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Технічний опис 36-6552-18 Aries Electronics

Description: CONN IC DIP SOCKET ZIF 36POS, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 250°C, Number of Positions or Pins (Grid): 36 (2 x 18), Termination: Solder, Housing Material: Polyetheretherketone (PEEK), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Nickel Boron, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Material - Mating: Beryllium Nickel, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Nickel Boron, Contact Finish Thickness - Post: 50.0µin (1.27µm), Contact Material - Post: Beryllium Nickel.

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36-6552-18 36-6552-18 Виробник : Aries Electronics 10002-high-temp-universal-dip-zif-test-socket-365089.pdf IC & Component Sockets FORCE DIP TEST SCKT HIGH TEMP 36 PINS
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