40-6554-18 Aries Electronics
Виробник: Aries ElectronicsDescription: CONN IC DIP SOCKET ZIF 40POS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 250°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyetheretherketone (PEEK), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Nickel
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Nickel
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Технічний опис 40-6554-18 Aries Electronics
Description: CONN IC DIP SOCKET ZIF 40POS, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 250°C, Number of Positions or Pins (Grid): 40 (2 x 20), Termination: Solder, Housing Material: Polyetheretherketone (PEEK), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Nickel Boron, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Material - Mating: Beryllium Nickel, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Nickel Boron, Contact Finish Thickness - Post: 50.0µin (1.27µm), Contact Material - Post: Beryllium Nickel.
Інші пропозиції 40-6554-18
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
 |
40-6554-18 | Виробник : Aries Electronics |
IC & Component Sockets FORCE DIP TEST SCKT HIGH TEMP 40 PINS |
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