BD71801GWL-E2 Rohm Semiconductor
Виробник: Rohm Semiconductor
Description: IC REG 17OUT BCK/LNR SYNC 50UCSP
Packaging: Cut Tape (CT)
Package / Case: 80-UFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -35°C ~ 85°C
Voltage - Supply: 2.6V ~ 5.5V
Applications: Mobile Communications
Current - Supply: 580µA
Supplier Device Package: 80-UCSP50L3C (3.8x3.8)
Part Status: Not For New Designs
Description: IC REG 17OUT BCK/LNR SYNC 50UCSP
Packaging: Cut Tape (CT)
Package / Case: 80-UFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -35°C ~ 85°C
Voltage - Supply: 2.6V ~ 5.5V
Applications: Mobile Communications
Current - Supply: 580µA
Supplier Device Package: 80-UCSP50L3C (3.8x3.8)
Part Status: Not For New Designs
на замовлення 2487 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 397.79 грн |
| 10+ | 345.99 грн |
| 25+ | 329.91 грн |
| 100+ | 268.81 грн |
| 250+ | 256.73 грн |
| 500+ | 234.08 грн |
| 1000+ | 200.54 грн |
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Технічний опис BD71801GWL-E2 Rohm Semiconductor
Description: IC REG 17OUT BCK/LNR SYNC 50UCSP, Packaging: Tape & Reel (TR), Package / Case: 80-UFBGA, CSPBGA, Mounting Type: Surface Mount, Operating Temperature: -35°C ~ 85°C, Voltage - Supply: 2.6V ~ 5.5V, Applications: Mobile Communications, Current - Supply: 580µA, Supplier Device Package: 80-UCSP50L3C (3.8x3.8), Part Status: Not For New Designs.
Інші пропозиції BD71801GWL-E2
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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BD71801GWL-E2 | Виробник : Rohm Semiconductor |
Description: IC REG 17OUT BCK/LNR SYNC 50UCSP Packaging: Tape & Reel (TR) Package / Case: 80-UFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -35°C ~ 85°C Voltage - Supply: 2.6V ~ 5.5V Applications: Mobile Communications Current - Supply: 580µA Supplier Device Package: 80-UCSP50L3C (3.8x3.8) Part Status: Not For New Designs |
товар відсутній |
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BD71801GWL-E2 | Виробник : ROHM Semiconductor |
 Power Management Specialised - PMIC DAC 8-CH R-2R 8-Bit 16-Pin SSOP-B T/R |
товар відсутній |