BM10NB(0.8)-20DS-0.4V(75) Hirose Electric Co Ltd
Виробник: Hirose Electric Co Ltd
Description: CONN RCPT 20POS SMD GOLD
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 20
Pitch: 0.016" (0.40mm)
Height Above Board: 0.031" (0.80mm)
Contact Finish Thickness: 4.00µin (0.100µm)
Mated Stacking Heights: 0.8mm
Part Status: Last Time Buy
Number of Rows: 2
Description: CONN RCPT 20POS SMD GOLD
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 20
Pitch: 0.016" (0.40mm)
Height Above Board: 0.031" (0.80mm)
Contact Finish Thickness: 4.00µin (0.100µm)
Mated Stacking Heights: 0.8mm
Part Status: Last Time Buy
Number of Rows: 2
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Технічний опис BM10NB(0.8)-20DS-0.4V(75) Hirose Electric Co Ltd
Description: CONN RCPT 20POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 20, Pitch: 0.016" (0.40mm), Height Above Board: 0.031" (0.80mm), Contact Finish Thickness: 4.00µin (0.100µm), Mated Stacking Heights: 0.8mm, Part Status: Last Time Buy, Number of Rows: 2.
Інші пропозиції BM10NB(0.8)-20DS-0.4V(75)
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
---|---|---|---|---|---|
BM10NB(0.8)-20DS-0.4V(75) | Виробник : Hirose Connector | Board to Board & Mezzanine Connectors 0.4MM FPC TO BOARD 20P RECP 0.8 HGHT |
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