DF9-19P-1V(32) Hirose Electric Co Ltd
Виробник: Hirose Electric Co LtdDescription: CONN HDR 19POS SMD TIN
Packaging: Cut Tape (CT)
Features: Board Guide, Solder Retention
Connector Type: Header, Center Strip Contacts
Contact Finish: Tin
Mounting Type: Surface Mount
Number of Positions: 19
Pitch: 0.039" (1.00mm)
Height Above Board: 0.130" (3.30mm)
Contact Finish Thickness: 39.4µin (1.00µm)
Mated Stacking Heights: 4.3mm
Number of Rows: 2
на замовлення 955 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 97.49 грн |
| 10+ | 79 грн |
| 25+ | 75.75 грн |
| 50+ | 69.54 грн |
| 100+ | 66.53 грн |
| 250+ | 60.48 грн |
| 500+ | 53.54 грн |
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Технічний опис DF9-19P-1V(32) Hirose Electric Co Ltd
Description: CONN HDR 19POS SMD TIN, Packaging: Tape & Reel (TR), Features: Board Guide, Solder Retention, Connector Type: Header, Center Strip Contacts, Contact Finish: Tin, Mounting Type: Surface Mount, Number of Positions: 19, Pitch: 0.039" (1.00mm), Height Above Board: 0.130" (3.30mm), Contact Finish Thickness: 39.4µin (1.00µm), Mated Stacking Heights: 4.3mm, Number of Rows: 2.
Інші пропозиції DF9-19P-1V(32)
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
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DF9-19P-1V(32) | Виробник : Hirose Electric Co Ltd |
Description: CONN HDR 19POS SMD TIN Packaging: Tape & Reel (TR) Features: Board Guide, Solder Retention Connector Type: Header, Center Strip Contacts Contact Finish: Tin Mounting Type: Surface Mount Number of Positions: 19 Pitch: 0.039" (1.00mm) Height Above Board: 0.130" (3.30mm) Contact Finish Thickness: 39.4µin (1.00µm) Mated Stacking Heights: 4.3mm Number of Rows: 2 |
товар відсутній |
|
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DF9-19P-1V(32) | Виробник : Hirose Connector |
Board to Board & Mezzanine Connectors 1.0MM V SMT HEADER 19P TIN PLATING |
товар відсутній |