FF3MR12KM1HHPSA1

FF3MR12KM1HHPSA1 Infineon Technologies


Виробник: Infineon Technologies
Description: FF3MR12KM1HHPSA1
Packaging: Box
Package / Case: Module
Mounting Type: Chassis Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 175°C (TJ)
Technology: Silicon Carbide (SiC)
Drain to Source Voltage (Vdss): 1200V (1.2kV)
Current - Continuous Drain (Id) @ 25°C: 190A (Tc)
Input Capacitance (Ciss) (Max) @ Vds: 24200pF @ 800V
Rds On (Max) @ Id, Vgs: 4.44mOhm @ 280A, 18V
Gate Charge (Qg) (Max) @ Vgs: 800nC @ 18V
Vgs(th) (Max) @ Id: 5.1V @ 112mA
Supplier Device Package: AG-62MMHB
товар відсутній

Відгуки про товар
Написати відгук

Технічний опис FF3MR12KM1HHPSA1 Infineon Technologies

Description: FF3MR12KM1HHPSA1, Packaging: Box, Package / Case: Module, Mounting Type: Chassis Mount, Configuration: 2 N-Channel (Half Bridge), Operating Temperature: -40°C ~ 175°C (TJ), Technology: Silicon Carbide (SiC), Drain to Source Voltage (Vdss): 1200V (1.2kV), Current - Continuous Drain (Id) @ 25°C: 190A (Tc), Input Capacitance (Ciss) (Max) @ Vds: 24200pF @ 800V, Rds On (Max) @ Id, Vgs: 4.44mOhm @ 280A, 18V, Gate Charge (Qg) (Max) @ Vgs: 800nC @ 18V, Vgs(th) (Max) @ Id: 5.1V @ 112mA, Supplier Device Package: AG-62MMHB.

Інші пропозиції FF3MR12KM1HHPSA1

Фото Назва Виробник Інформація Доступність
Ціна без ПДВ
FF3MR12KM1HHPSA1 FF3MR12KM1HHPSA1 Виробник : Infineon Technologies Infineon_01_29_2024_DS_FF3MR12KM1H_v0_10_en-3392475.pdf Discrete Semiconductor Modules
товар відсутній