R7F7017143ABG-C#BC1 Renesas Electronics America Inc

Description: 32BIT MCU RH850/F1KH-D8 BGA324, Packaging: Tray, Package / Case: 324-FBGA, Mounting Type: Surface Mount, Speed: 240MHz, Program Memory Size: 6MB (6M x 8), RAM Size: 896K x 8, Operating Temperature: -40°C ~ 105°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, EEPROM Size: 256K x 8, Core Processor: RH850G3KH, Data Converters: A/D 38x10b, 32x12b, Core Size: 32-Bit Dual-Core, Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V, Connectivity: CANbus, CSI, I²C, LINbus, SPI, UART/USART, Peripherals: DMA, PWM, WDT, Supplier Device Package: 324-FBGA (19x19), Part Status: Active, Number of I/O: 246.