Технічний опис SIDC02D60C6X1SA4 Infineon Technologies
Description: DIODE GP 600V 6A WAFER, Packaging: Bulk, Package / Case: Die, Mounting Type: Surface Mount, Speed: Standard Recovery >500ns, > 200mA (Io), Technology: Standard, Current - Average Rectified (Io): 6A, Supplier Device Package: Sawn on foil, Operating Temperature - Junction: -40°C ~ 175°C, Voltage - DC Reverse (Vr) (Max): 600 V, Voltage - Forward (Vf) (Max) @ If: 1.95 V @ 6 A, Current - Reverse Leakage @ Vr: 27 µA @ 600 V.
Інші пропозиції SIDC02D60C6X1SA4
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
| SIDC02D60C6X1SA4 | Виробник : Infineon Technologies |
 Description: DIODE GP 600V 6A WAFERPackaging: Bulk Package / Case: Die Mounting Type: Surface Mount Speed: Standard Recovery >500ns, > 200mA (Io) Technology: Standard Current - Average Rectified (Io): 6A Supplier Device Package: Sawn on foil Operating Temperature - Junction: -40°C ~ 175°C Voltage - DC Reverse (Vr) (Max): 600 V Voltage - Forward (Vf) (Max) @ If: 1.95 V @ 6 A Current - Reverse Leakage @ Vr: 27 µA @ 600 V |
товар відсутній |