Технічний опис ST124 ST
Description: SOIC-20 SMD TO DIP ADAPTER, Packaging: Bag, Size / Dimension: 1.200" L x 0.800" W (30.48mm x 20.32mm), Material: FR4 Epoxy Glass, Number of Positions: 20, Pitch: 0.050" (1.27mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: SMD to DIP, Package Accepted: SOIC, Part Status: Active.
Інші пропозиції ST124
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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ST-124 | Виробник : SchmalzTech, LLC |
 Description: SOIC-20 SMD TO DIP ADAPTERPackaging: Bag Size / Dimension: 1.200" L x 0.800" W (30.48mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
товар відсутній |