WS991SNL500T4 Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: SOLDER PASTE THERMALLY STABLE WS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: Water Soluble
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE THERMALLY STABLE WS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: Water Soluble
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
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Технічний опис WS991SNL500T4 Chip Quik Inc.
Description: SOLDER PASTE THERMALLY STABLE WS, Packaging: Bulk, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Type: Solder Paste, Melting Point: 423°F (217°C), Form: Jar, 17.64 oz (500g), Mesh Type: 4, Process: Lead Free, Flux Type: Water Soluble, Shelf Life Start: Date of Manufacture, Shelf Life: 6 Months.
Інші пропозиції WS991SNL500T4
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
---|---|---|---|---|---|
WS991SNL500T4 | Виробник : Chip Quik | Solder Thermally Stable Solder Paste WS (Water-Soluble) Sn96.5/Ag3.0/Cu0.5 T4 (500g jar |
товар відсутній |