Технічний опис X66AK2H12AAAWA24 Texas Instruments
Description: IC DSP ARM SOC BGA, Packaging: Tray, Package / Case: 1517-BBGA, FCBGA, Mounting Type: Surface Mount, Interface: EBI/EMI, Ethernet, DMA, I²C, Serial RapidIO, SPI, UART/USART, USB 3.0, Type: DSP+ARM®, Operating Temperature: -40°C ~ 100°C (TC), Non-Volatile Memory: ROM (384kB), On-Chip RAM: 12.75MB, Voltage - I/O: 0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V, Voltage - Core: Variable, Clock Rate: 1.2GHz DSP, 1.4GHz ARM®, Supplier Device Package: 1517-FCBGA (40x40).
Інші пропозиції X66AK2H12AAAWA24
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X66AK2H12AAAWA24 | Виробник : Texas Instruments |
 Description: IC DSP ARM SOC BGAPackaging: Tray Package / Case: 1517-BBGA, FCBGA Mounting Type: Surface Mount Interface: EBI/EMI, Ethernet, DMA, I²C, Serial RapidIO, SPI, UART/USART, USB 3.0 Type: DSP+ARM® Operating Temperature: -40°C ~ 100°C (TC) Non-Volatile Memory: ROM (384kB) On-Chip RAM: 12.75MB Voltage - I/O: 0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V Voltage - Core: Variable Clock Rate: 1.2GHz DSP, 1.4GHz ARM® Supplier Device Package: 1517-FCBGA (40x40) |
товар відсутній |