XIAO ESP32C3 SEEED STUDIO
Виробник: SEEED STUDIO
Category: Development kits for data transmission
Description: Dev.kit: evaluation; ADC,GPIO,I2C,I2S,SPI,UART; ESP32-C3; XIAO
Operating temperature: -40...85°C
Interface: ADC; GPIO; I2C; I2S; SPI; UART
Number of pins: 2x 7
Dimensions: 21x17.5mm
Communictions protocol: Bluetooth 5.0; WIFI
Manufacturer series: XIAO
Kind of architecture: RISC-V
Type of development kit: evaluation
Components: ESP32-C3
Memory: 192kB SRAM; 400kB SRAM; 4MB FLASH
Kind of connector: solder pads; U.FL; USB C socket
Kit contents: prototype board; u.FL antenna
кількість в упаковці: 1 шт
Category: Development kits for data transmission
Description: Dev.kit: evaluation; ADC,GPIO,I2C,I2S,SPI,UART; ESP32-C3; XIAO
Operating temperature: -40...85°C
Interface: ADC; GPIO; I2C; I2S; SPI; UART
Number of pins: 2x 7
Dimensions: 21x17.5mm
Communictions protocol: Bluetooth 5.0; WIFI
Manufacturer series: XIAO
Kind of architecture: RISC-V
Type of development kit: evaluation
Components: ESP32-C3
Memory: 192kB SRAM; 400kB SRAM; 4MB FLASH
Kind of connector: solder pads; U.FL; USB C socket
Kit contents: prototype board; u.FL antenna
кількість в упаковці: 1 шт
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Технічний опис XIAO ESP32C3 SEEED STUDIO
Category: Development kits for data transmission, Description: Dev.kit: evaluation; ADC,GPIO,I2C,I2S,SPI,UART; ESP32-C3; XIAO, Operating temperature: -40...85°C, Interface: ADC; GPIO; I2C; I2S; SPI; UART, Number of pins: 2x 7, Dimensions: 21x17.5mm, Communictions protocol: Bluetooth 5.0; WIFI, Manufacturer series: XIAO, Kind of architecture: RISC-V, Type of development kit: evaluation, Components: ESP32-C3, Memory: 192kB SRAM; 400kB SRAM; 4MB FLASH, Kind of connector: solder pads; U.FL; USB C socket, Kit contents: prototype board; u.FL antenna, кількість в упаковці: 1 шт.
Інші пропозиції XIAO ESP32C3
Фото | Назва | Виробник | Інформація |
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XIAO ESP32C3 | Виробник : SEEED STUDIO |
Category: Development kits for data transmission Description: Dev.kit: evaluation; ADC,GPIO,I2C,I2S,SPI,UART; ESP32-C3; XIAO Operating temperature: -40...85°C Interface: ADC; GPIO; I2C; I2S; SPI; UART Number of pins: 2x 7 Dimensions: 21x17.5mm Communictions protocol: Bluetooth 5.0; WIFI Manufacturer series: XIAO Kind of architecture: RISC-V Type of development kit: evaluation Components: ESP32-C3 Memory: 192kB SRAM; 400kB SRAM; 4MB FLASH Kind of connector: solder pads; U.FL; USB C socket Kit contents: prototype board; u.FL antenna |
товар відсутній |